S SPEC FOR TRACKING BROADCOM BUSINESS ONLY-SOLD THRU DISTI

Heat Sink Passive Pin Array Adhesive Black Anodized

Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm

Heat Sink Passive Pin Array Adhesive 23.4°C/W Black Anodized

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Heat Sink Passive BGA Pin Array Adhesive Plastic 62.5°C/W Black Anodized

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Heat Sink, 15.6 °C/W, TO-220, 44.45 mm, 9.52 mm, 17.78 mm

Heat Sink, Square, PCB, Hat Section, 9.6 °C/W, TO-220, 44.5 mm, 9.53 mm, 37.3 mm

Heat Sink, Square, PCB, 24 °C/W, TO-220, 19.05 mm, 9.67 mm, 19.05 mm

Heat Sink Passive TO-218/TO-247 Radial Thru-Hole 13.4°C/W Black Anodized

Heat Sink Passive TO-220 Radial Thru-Hole 13.4°C/W Black Anodized

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Heat Sink, Square, PCB, Extruded, With Radial Fins, 5.5 °C/W, TO-218, TO-247, 41.9 mm, 25.4 mm

Heat Sink, Square, PCB, Extruded, With Radial Fins, 3.7 °C/W, TO-220, 41.9 mm, 38.1 mm, 38.1 mm

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Heat Sink Passive TO-218/TO-247 Twisted Thru-Hole 6.3°C/W Black Anodized