Laird Technologies
We serve as a trusted partner to the world’s leading technology brands, offering world-class materials science and engineering expertise to solve the most complex problems and delivering custom-engineered solutions that push the boundaries of technology.
Laird thermal solutions enable and protect electronics at the system and device level, filling in air gaps and microscopic irregularities to lower thermal resistance and better cool components. Laird electromagnetic products mitigate disruptive waste energy by significantly lowering stray electromagnetic interference. And our portfolio of multifunctional (MFS) solutions simultaneously mitigates EMI and transfers heat with all-in-one designs that solve myriad design engineering issues.
Artificial Intelligence
Heat is a huge roadblock to AI’s success. See why AI designers look to Laird for answers.
Automotive
Soft, non-silicone-based gap filler materials satisfy several needs of design engineers pressed to meet growing compliance requirements. See Laird Technologies’ expanding family of high deflection force thermal transfer solutions.
Aerospace and Defense
Crowded, complex military systems must suppress excessive radiated emissions to avoid enemy detection. Our rugged, reliable products shield the warfighter.
Data and Communication
Laird Technologies’ low volatile form-in-place silicone paste ensures precision, ultra small bead dispensing onto small, delicate devices.
Consumer Electronics
When a wearable technology manufacturer hit thermal management roadblock, new ideas were few. Read how experts and an ultra-thin bondline product solution helped meet a team’s launch deadlines.
Medical Devices
When seconds can mean life or death, reliability means everything. Compact devices pack powerful components like defibrillators can require multifunctional solutions to tame heat and suppress signal interference.
Test and Measurement
Excessive heat robs integrated circuit performance. See a recent gap filler pad “spring-back” innovation that sustains its low thermal resistance after device assembly.
Industrial
Selecting the right RF/microwave absorber materials demands many considerations. Read our advice about considerations that must be made to boost signal integrity.
Silicone Free Thermal Gap Fillers
Introducing Laird's Tflex™️SF4, SF7, and SF10, non-silicone-based gap fillers engineered for outstanding thermal performance. With ultra-low thermal resistance and high deflection, they protect critical components with confidence and precision.