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Laird Technologies

Laird, part of Qnity, is a global solutions provider of advanced electronic materials for thermal management and signal integrity. Qnity is a premier technology solutions provider across the semiconductor value chain, empowering AI, high performance computing, and advanced connectivity. From groundbreaking solutions for semiconductor chip manufacturing, to enabling high-speed transmission within complex electronic systems, Qnity’s high-performance materials and integration expertise make tomorrow’s technologies possible.We serve as a trusted partner to the world’s leading technology brands, offering world-class materials science and engineering expertise to solve the most complex problems and delivering custom-engineered solutions that push the boundaries of technology.Laird thermal solutions enable and protect electronics at the system and device level, filling in air gaps and microscopic irregularities to lower thermal resistance and better cool components. Laird electromagnetic products mitigate disruptive waste energy by significantly lowering stray electromagnetic interference. And our portfolio of multifunctional (MFS) solutions simultaneously mitigates EMI and transfers heat with all-in-one designs that solve myriad design engineering issues.
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Image Product New
Product Image MEAN WELL LOP Series Open Frame Power Supplies
The MEAN WELL  LOP Series delivers high power density and efficiency in a slim, open-frame  design for space-constrained systems. Available from 200W to 600W, the series  combines compact 4" x 2" and 5" x 3" form factors with a  wide 80–264VAC input Nov 9, 2026, 12:00:00 AM GMT
Nov 9, 2026, 12:00:00 AM GMT
Product Image Abracon AANE-PU-0121-3
The Abracon AANE-PU-0121-3 is a compact adhesive-mount puck antenna that combines LTE and multi-constellation GNSS connectivity in a 59.5 × 52.5 × 16.5 mm housing. Designed for demanding connected applications, the antenna features an IP67-rated, UV- Nov 6, 2026, 12:00:00 AM GMT
Nov 6, 2026, 12:00:00 AM GMT
Product Image Lumissil IS31FL3713 4×3 Matrix LED Driver with Integrated Boost
The Lumissil IS31FL3713 is a 4×3 matrix LED driver designed to control up to 12 individual LEDs or four RGB LEDs in compact, battery-powered applications. An integrated synchronous boost converter operates at 1MHz, supports inductors as small as 1μH Nov 4, 2026, 12:00:00 AM GMT
Nov 4, 2026, 12:00:00 AM GMT
Product Image SCHURTER 4763 IEC Appliance Combi-Outlet Type F/J
The SCHURTER 4763 is a combined IEC Type F/J appliance outlet designed for smart power distribution units (PDUs) and UPS applications. Its snap-in, front-side panel mounting and PCB terminals support streamlined integration, while the Type F/J outlet Nov 4, 2026, 12:00:00 AM GMT
Nov 4, 2026, 12:00:00 AM GMT
Product Image Advanced Energy DF150 Series
The Advanced Energy Defiant Future™ DF150 Series is a ruggedized 160 W AC-DC power supply designed for demanding defense and commercial applications. Delivering 27 V at 5.93 A, the fully enclosed supply combines MIL-STD compliance with the deployment Nov 4, 2026, 12:00:00 AM GMT
Nov 4, 2026, 12:00:00 AM GMT
Product Image Hirose Electric FX36 Series
The Hirose Electric FX36 Series is a compact, 0.5 mm-pitch floating board-to-board connector engineered for automotive and industrial systems exposed to vibration and PCB movement. Its floating structure absorbs misalignment of up to ±0.7 mm in both Oct 30, 2026, 12:00:00 AM GMT
Oct 30, 2026, 12:00:00 AM GMT
Product Image Murata MRMS16 Series Magnetic Switch Sensors
The Murata Power Solutions MRMS166R is an ultra-low-power AMR magnetic sensor designed for contactless ON/OFF switching in compact, battery-powered electronics. With typical average current consumption of just 20 nA at 1.5 V and a 1.2 V to 3.6 V supp Oct 29, 2026, 12:00:00 AM GMT
Oct 29, 2026, 12:00:00 AM GMT
Product Image SMT Microminiature Tactile Switch with Side-Actuator
The SCHURTER TCSV4 is an SMT microminiature tactile switch engineered for applications where PCB space is at a premium. With dimensions of just 4.5 × 2.25 × 2.6 mm, it is well suited for compact electronic products and portable devices. As an edge-m Oct 28, 2026, 12:00:00 AM GMT
Oct 28, 2026, 12:00:00 AM GMT
Product Image Abracon AANI-CH-0246 On-Ground 3D Chip Antenna
The Abracon AANI-CH-0246 is a compact 2.4 GHz chip antenna engineered for wireless IoT devices supporting Bluetooth®, BLE, Wi-Fi®, Thread, Matter, and other 2.4 GHz protocols. Designed around a unique 3D ceramic helix architecture, it combines the sp Oct 28, 2026, 12:00:00 AM GMT
Oct 28, 2026, 12:00:00 AM GMT
Product Image Molex EasyLock D-Sub Connector Backshells
Molex EasyLock D-Sub Connector Backshells are designed to simplify D-sub connector installation with an innovative push-in locking mechanism that eliminates the need for tools or screw assembly. The single-handed locking and release design helps redu Oct 27, 2026, 12:00:00 AM GMT
Oct 27, 2026, 12:00:00 AM GMT
Product Image TE Connectivity External On-Metal Tri-Band Wi Fi Antenna
The TE Connectivity 2195966-1 is a low-profile external tri-band Wi-Fi antenna engineered for metal-chassis installations. Covering frequencies from 2400 MHz to 7125 MHz, it supports the latest Wi-Fi technologies along with Bluetooth and ZigBee conne Oct 27, 2026, 12:00:00 AM GMT
Oct 27, 2026, 12:00:00 AM GMT
Product Image Laird Tflex™ CR550 Two-Part Liquid Gap Filler
Tflex™ CR550 from Laird™ is a two-part liquid dispensable thermal gap filler designed to efficiently transfer heat away from high-power electronic assemblies. Engineered for applications such as onboard chargers, control boxes, DC-DC converters, inve Oct 27, 2026, 12:00:00 AM GMT
Oct 27, 2026, 12:00:00 AM GMT
Product Image SCHURTER MSM II XP Vandal-Resistant Pushbutton Switch
The SCHURTER MSM II XP expands the proven MSM II Metal Line switch family with a new housing option manufactured from high-performance LEXAN™ polycarbonate. Designed for applications that require durability, electrical insulation, reduced weight, and Oct 27, 2026, 12:00:00 AM GMT
Oct 27, 2026, 12:00:00 AM GMT
Product Image Molex AirBorn SInergy Modular High-Speed Hybrid Connectors
Molex AirBorn SInergy Modular High-Speed Hybrid Connectors are designed for demanding aerospace, defense, and space applications that require reliable high-speed data, power, and RF connectivity in a compact footprint. Featuring a configurable modula Oct 27, 2026, 12:00:00 AM GMT
Oct 27, 2026, 12:00:00 AM GMT
Product Image Micron DDR5 DRAM 160s Portfolio Memory Solutions
Micron's DDR5 DRAM 160s Portfolio is engineered to help designers meet the growing demands of AI, edge computing, industrial automation, networking, communications infrastructure, and advanced automotive platforms. Built on a high-density 16Gb archit Oct 26, 2026, 12:00:00 AM GMT
Oct 26, 2026, 12:00:00 AM GMT
Product Image Molex VersaPower Connectors
Molex VersaPower Connectors (Series 226276 / 226277) are next-generation board-to-board connectors designed for high-density, high-current applications. Featuring a fine 0.30 mm pitch and an ultra-low 0.60 mm mated height, they help engineers maximiz Oct 26, 2026, 12:00:00 AM GMT
Oct 26, 2026, 12:00:00 AM GMT
Product Image Aratas G3VH High-Voltage SiC MOSFET Relay
Aratas' G3VH Series SiC MOSFET relays are engineered for high-voltage switching applications in automated test equipment, measurement systems, and power semiconductor testing. By combining silicon carbide (SiC) MOSFET technology with a compact solid- Oct 22, 2026, 12:00:00 AM GMT
Oct 22, 2026, 12:00:00 AM GMT
Product Image TE Connectivity IP67/IP69K Mini-FAKRA Connectors
TE Connectivity's IP67/IP69K Mini-FAKRA connectors and cable assemblies are engineered to deliver reliable high-frequency RF connectivity in challenging industrial and outdoor environments. Designed with a compact, high-density footprint, these solut Oct 21, 2026, 12:00:00 AM GMT
Oct 21, 2026, 12:00:00 AM GMT
Product Image Renesas RZ/G3L & RZ/G3SE Industrial MPUs
The Renesas RZ/G3L and RZ/G3SE microprocessor families provide a scalable, high-performance platform for industrial and embedded systems, combining Arm Cortex-A55 application processing with a Cortex-M33 management core. Designed for HMI, IoT, gatewa Oct 20, 2026, 12:00:00 AM GMT
Oct 20, 2026, 12:00:00 AM GMT
Product Image Microchip's Flexible Development & Comprehensive Support - MCU Designs
When lead times and pricing become unpredictable, the impact goes beyond component availability – it can put your design schedule, production plans and time-to-market at risk. Microchip’s broad MCU portfolio provides more options to maintain design Oct 19, 2026, 5:00:00 AM GMT
Oct 19, 2026, 5:00:00 AM GMT
Product Image Cirrus Logic P & S Series Audio Converters
Cirrus Logic’s P & S Series audio converters are designed to deliver exceptional audio fidelity for professional and prosumer applications. Combining advanced analog performance with integrated digital capabilities, these converters enable accurate a Oct 12, 2026, 12:00:00 AM GMT
Oct 12, 2026, 12:00:00 AM GMT
Product Image Hirose BK35 High-Speed FPC-to-Board Connector
The Hirose BK35 Series is a fully shielded, power/signal hybrid FPC-to-board connector designed for high-speed, space-constrained electronic systems. Featuring a 0.35 mm pitch, 0.6 mm stacking height, and compact 2.2 mm depth, the connector helps max Sep 30, 2026, 12:00:00 AM GMT
Sep 30, 2026, 12:00:00 AM GMT
Product Image NXP MCX C15 and MCX C16 MCUs
The MCX C15 and MCX C16 microcontrollers from NXP Semiconductors provide an affordable entry point into 32-bit embedded processing, combining an Arm® Cortex®-M23 core operating at speeds up to 72 MHz with up to 64 KB of on-chip Flash memory and 16 KB Sep 29, 2026, 12:00:00 AM GMT
Sep 29, 2026, 12:00:00 AM GMT
Product Image Amphenol DuraSwap™ Connectors
Amphenol's DuraSwap™ connectors are engineered for battery and docking applications requiring high current handling, long mechanical life, and robust environmental sealing. Available with 2 power and 6 signal contacts, they support continuous current Sep 21, 2026, 8:00:00 AM GMT
Sep 21, 2026, 8:00:00 AM GMT
Product Image AMD Ryzen™ AI Embedded X100 Series Processors
Leadership Performance and Integration for Real-World, Mixed Workloads AMD Ryzen™ AI Embedded X100 Series processors combine an x86 CPU, a discrete-class integrated GPU (iGPU), and an NPU in a single SoC to deliver high-performance heterogeneous pro Sep 17, 2026, 12:00:00 AM GMT
Sep 17, 2026, 12:00:00 AM GMT
Showing 1 to 25 of 63 products
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artificial-intelligence

Artificial Intelligence

Heat is a huge roadblock to AI’s success. See why AI designers look to Laird for answers.

automotive

Automotive

Soft, non-silicone-based gap filler materials satisfy several needs of design engineers pressed to meet growing compliance requirements. See Laird Technologies’ expanding family of high deflection force thermal transfer solutions.

aerospace-and-defense

Aerospace and Defense

Crowded, complex military systems must suppress excessive radiated emissions to avoid enemy detection. Our rugged, reliable products shield the warfighter.

data-and-communication

Data and Communication

Laird Technologies’ low volatile form-in-place silicone paste ensures precision, ultra small bead dispensing onto small, delicate devices.

consumer-electronics

Consumer Electronics

When a wearable technology manufacturer hit thermal management roadblock, new ideas were few. Read how experts and an ultra-thin bondline product solution helped meet a team’s launch deadlines.

medical-devices

Medical Devices

When seconds can mean life or death, reliability means everything. Compact devices pack powerful components like defibrillators can require multifunctional solutions to tame heat and suppress signal interference.

test-and-measurement

Test and Measurement

Excessive heat robs integrated circuit performance. See a recent gap filler pad “spring-back” innovation that sustains its low thermal resistance after device assembly.

industrial

Industrial

Selecting the right RF/microwave absorber materials demands many considerations. Read our advice about considerations that must be made to boost signal integrity.

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