Product Highlights

Introducing New and Featured Products

TE Connectivity

Your perfect partners for IIoT

We'll help you revolutionize your factory floor.

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Infineon EiceDRIVER 1EDS-SRC - Grid

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Infineon

EiceDRIVER™ 1EDS-SRC family

The new SRC EiceDRIVER™ family serves the latest generation of highly efficient low-EMI electric drive systems with lower EMI and improved efficiency.

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STMicroelectronics

S2-LP

The S2-LP is a high performance ultra-low power RF transceiver, intended for RF wireless applications in the sub-1 GHz band.

Huawei 3G, 4G wireless module & 3G, 4G light industry dongle
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microchip-competative-edge-of-iot

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Microchip

The Competitive Edge of IoT: Your Path to Analog

Find a path to analog through components and services designed for a digital mindset with your partners in IoT development, Avnet and Microchip.

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Vishay

T58 - Microtan® polymer capacitors

Vishay's MicroTan polymer capacitors are the prefered choice for use in audio applications

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Microchip

USB7002 SmartHub IC

Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems

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ON Semiconductor

NCV-RSL10

Radio SoC, ultra-low-power multi-protocol Bluetooth® 5 certified for automotive

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GBL_201908PF IFX iMotion IMM100

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Infineon

iMOTION™ IMM100 Smart IPM

iMOTION™ IMM100 is a series of fully integrated Smart IPMs implementing sensorless Field Oriented Control (FOC) of a Permanent Magnet Synchronous Motor (PMSM).

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GBL_201907FP Molex slimstack connector

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Molex

SlimStack Board-to-Board Connectors

SlimStack Board-to-Board Connectors, 0.40mm Pitch Floating, FSB5 Series feature a large floating range for space-saving and design flexibility, making them ideal for a wide range of applications in the automotive, industrial and consumer industries.

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Murata

CMWX1ZZABZ-078 CMWX1ZZABZ-091

Murata CMWX1ZZABZ module is a new, compact, low cost, low power wide area network (LPWAN) wireless module that supports the LoRaWAN long range wireless protocol.

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Nordic

nRF9160 SiP

Nordic's nRF91 Series is an ultra-compact, low power, global, multimode LTE-M / NB-IoT System-in-Package with integrated Arm Cortex-M33 host processor, Arm TrustZone security technology, and Assisted GPS

Huawei 3G, 4G wireless module & 3G, 4G light industry dongle
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Maxim

MAX9814/MAX98090

Microphone amplifier with AGC and low-noise microphone bias

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Panasonic

SMD film capacitor ECHU(X) series

Stacked metallized PPS film chip capacitor. Contribute to the high efficiency with supreme electric characteristics.

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STMicroelectronics

NFC/RFID ST25R3914

The ST25R3914/5 are highly integrated NFC Initiators / HF Reader ICs for automotive applications.

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Wisol

Sigfox Module

Wisol compact SMT wireless modules for global Sigfox applications.

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Infineon

Automotive Smart High-side Switch PROFET™+ 2

PROFET™ intelligent power high side switches consist of a DMOS power transistor and CMOS logic circuitry for complete built-in protection.

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STMicroelctronics

STM32MP1

A general-purpose microprocessor portfolio enabling easy development for a broad range of applications, the STM32MP1 series is based on a heterogeneous single or dual Arm Cortex-A7 and Cortex-M4 cores architecture.

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Maxim

GMSL SerDes enable ADAS

Gigabit Multimedia Serial Link (GMSL) serializer and deserializers (SerDes) are high-speed communication ICs that fully support the high bandwidth, complex interconnect, and data integrity requirements needed.

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Vishay

V8PM10SHM3

Boost/buck diodes for automotive LED head light

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TE Connectivity

Dynamic D3950 Series Connectors

TE Connectivity (TE) expands its Dynamic D3950 series with 4-position X-key and Y-key headers and receptacles for enhanced mis-mating proof. D3950 series is mainly designed for servo drives.

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Microchip

SAM R34/35 devices

With industry-leading low power consumption, the SAM R34/35 devices enable long-range wireless connectivity while extending system battery life.

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Quectel

BG96 & BC66

BG96 is a series of LTE Cat.M1/Cat.NB1/EGPRS module offering a maximum data rate of 375kbps downlink and uplink. BC66 is a high-performance, multi-band NB-IoT module with extremely low power consumption.

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Laird Performance Materials

Tgard™ K52

Thermally conductive insulator pad with high thermal and dielectric performance for use in audio amplifiers, power modules and switching mode power supplies designed as part of low-power wide area networks (LPWAN).

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ON Semiconductor

LC823450

Low power & high-resolution audio processing System-on-Chip (SoC)

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GBL_201906FP Molex USB smart charge

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Molex

Dual-port USB Smart Charge Module

Molex USB smart-charge modules lead the market by combining automotive-grade durability and off-the-shelf availability through distribution.

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Laird Performance Materials

Removable Top Board-Level Shield

The ReCovr line has the functionality of a two-piece shield in effectively shielding against stray electromagnetic interference. However, there is no need for a separate frame and cover.

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