Toshiba 80V N-channel MOSFETs for 48V Systems in Automotive Equipment

Global trend of moving from 12V systems to 48V in vehicle electrical infrastructure that balances power, efficiency, and safety to unlock the next generation of intelligent, electrified mobility.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the "U-MOSX-H series" automotive 80V N-channel MOSFETs, adopted the SOP Advance(WF) package, expanding its lineup suitable for 48V systems in automotive equipment. These products feature low On-resistance for the power saving of equipment, with a drain-source On-resistance of 2.55mΩ (max) for the "XPH2R608QB" and 3.9mΩ (max) for the "XPH3R908QB".

The new products comply with the automotive reliability standard AEC-Q101 and feature a surface-mount type SOP Advance(WF) package that uses a wettable flank structure. It offers high visibility of solder fillets, making it easy to verify the board mounting conditions with automatic visual inspection (AVI) equipment, thereby contributing to the automation of inspections on the production line. Furthermore, it adopts a Cu connector structure to reduce package resistance.

The shift to 48V automotive systems has been progressing to reduce power loss and to achieve thinner and lighter wiring harnesses by lowering current. MOSFETs used in 48V automotive systems are required to have a withstand voltage of at least 80V and a low On-resistance. To meet these requirements, Toshiba has developed 80V MOSFETs with low On-resistance.

Toshiba will continue to develop automotive MOSFET products suitable for 48V systems to meet the diverse needs of our customers and support various applications for automotive equipment.

Features

• Automotive 80V MOSFETs with low On-resistance using SOP Advance(WF) package
• SOP Advance(WF) package with a wettable flank structure that facilitates automatic visual inspection of the board mounting conditions

Application

       48V systems in automotive equipment

• Motor drives, switched-mode power supplies, load switches, etc.

Key Components 

• Automotive 80V MOSFETs with low On-resistance using SOP Advance(WF) package

The new products, XPH2R608QB and XPH3R908QB, are the first automotive 80V products to be adopted in the SOP Advance(WF) package.
These products have achieved low On-resistance (RDS(ON)) by utilizing the latest generation U-MOSX-H process and adopting the SOP Advance(WF) package with a Cu connector structure to reduce package resistance.
The lineup of automotive 80V U-MOSX-H series also includes the XPQR8308QB, which features the high heat dissipation L-TOGL™ package.

• SOP Advance(WF) package with a wettable flank structure that facilitates automatic visual inspection of the board mounting conditions

The SOP Advance(WF) package adopts a wettable flank structure at the terminal cut-off section. This structure (wettable flank) improves the visibility and solder wettability of the soldered state. This makes it easier to check the component mounting state with automatic visual inspection (AVI) equipment, which also contributes to improved reliability.

Block Diagram