Scale AI Infrastructure with 48V Power Distribution

Molex OCP ORV3 solutions enable reliable, high-current 48V power distribution across power shelves, battery backup units and IT equipment, supporting scalable rack architectures for AI and high-performance computing.

As AI and high-performance computing increase rack-level power requirements, data centers need scalable and adaptable power-distribution infrastructure. Molex OCP ORV3 connectivity solutions support 48V rack architectures while balancing spatial, thermal and power-efficiency requirements. Designed in alignment with OCP power-rack infrastructure definitions, the solutions connect power shelves and battery backup units to the rack busbar and distribute power to IT equipment. Their flexible, modular and scalable design helps data centers accommodate increasing rack densities and future capacity growth.

Features

• OCP ORV3-compliant 48V rack-level power architecture
• Supports high-current power delivery for AI, HPC and cloud computing environments
• Connects power shelves, battery backup units (BBUs) and IT equipment across the rack power ecosystem
• Modular, scalable design supports increasing rack densities and future capacity growth
• Balances spatial, thermal and power-efficiency requirements in high-density deployments
• Reliable blind-mate connectivity with ±3.00mm float for alignment tolerance during installation

Applications

       Data Center Solutions

• AI and high-performance computing racks
• Rack-mount servers
• Data storage equipment
• Power supplies
• Networking equipment
• Network interfaces
• Routers
• Switches

       Telecommunications

• Base stations
• Routers
• Switches

Key Components 

• 48V ORV3 Busbar

        Provides the rack-level power-distribution backbone.

• Power Shelf and Battery Backup Unit Output Connector, 500A+

       Connects the power shelf or BBU to the rack busbar.

• IT Gear Input Connector, 100A+

       Transfers power from the running busbar to server and other IT equipment.

Benefits

• Supports scalable 48V rack power architectures for increasing AI capacity
• Compensates for mating misalignment with ±3.00mm float
• Supports system protection through optional hot-swap sense contacts
• Reduces connection complexity with optional integrated chassis grounding
• Provides reliable termination and low voltage drop through welded terminals
• Enables flexible, modular ORV3 power distribution across power shelves, BBUs and IT equipment