Article

How the EV drivetrain is moving toward function consolidation

 generic graphic of person
A wireframe of an electric car showing the battery and key electrical components
NXP is developing a product portfolio to address the need for function consolidation in EVs
KEY TAKEAWAYS:
  • EV powertrains are moving from distributed to consolidated
  • Greater integration reduces cost and supply chain complexity
  • Challenges exist, including software and safety

Modern electric vehicle (EV) powertrain design is increasingly driven by system consolidation, where multiple traditionally separate electronic control units and power electronics stages are integrated into fewer modules, sometimes converging into a single compute platform.

The application domain spans traction inverter control, onboard charging, DC/DC conversion, battery management, vehicle control, and auxiliary energy distribution systems. In parallel, thermal management and power distribution units are also being considered for tighter integration within unified architectures.

The e-axle is one such target architecture, where the traction inverter, gearbox integration, and motor control are combined into a compact assembly. Beyond this, broader vehicle electrification trends aim to merge onboard charger functionality, high-voltage and low-voltage DC/DC conversion, and even battery management into consolidated electronic platforms.

The direction of travel is from distributed control systems toward centralized computing domains that can coordinate multiple high-speed control loops within a single hardware and software ecosystem.

At the most advanced level, the integration approach extends to a single-chip or highly consolidated system-on-chip architecture. In this model, multiple vehicle functions are partitioned across different processor cores, allowing safety-critical, communication, and high-performance control tasks to coexist while remaining logically isolated.

This enables a shift from hardware proliferation toward software-defined vehicle control, where the same compute platform can execute multiple electrification functions simultaneously.

The challenges of consolidation

The primary challenge in this level of integration is managing complexity across electrical, thermal, and software domains simultaneously. As multiple subsystems converge, system designers must reconcile requirements that traditionally belonged to separate ECUs, each optimized independently for performance, safety, and cost. One major constraint is functional safety isolation.

When multiple control loops such as motor control, charging regulation, and battery supervision operate on a shared processing platform, strict separation is required to prevent fault propagation.

Ensuring safe isolation between tasks running on different cores becomes critical, particularly when systems must meet automotive safety integrity requirements. This introduces additional design effort in both hardware partitioning and software architecture. Thermal management also becomes significantly more demanding as integration increases.

Consolidating power electronics such as inverters and DC/DC converters into a single enclosure increases power density. As a result, traditional cooling approaches may become insufficient, requiring more advanced solutions such as liquid cooling systems or enhanced heat dissipation strategies to maintain operational stability and reliability.

Another challenge arises from system scalability and maintainability. While integration reduces physical hardware complexity, it also reduces modular independence. In the event of a failure, a tightly integrated ECU or consolidated unit may require full replacement rather than partial servicing. This increases maintenance impact and introduces higher system-level dependency on a single hardware platform.

Software complexity also increases substantially. Consolidating multiple functions into one compute environment requires large-scale software integration, where teams must coordinate across previously independent domains. This can increase development effort, require more specialized expertise, and introduce challenges in validating interactions between subsystems.

In addition, functional safety analysis becomes more complex, as failure modes must be evaluated across a denser and more interconnected software stack.

Supply chain and integration challenges can emerge when combining components and subsystems sourced from different vendors. Aligning hardware interfaces, control requirements, and safety mechanisms across heterogeneous components increases system integration effort and validation overhead.

Supporting the shift toward X-in-1 solutions

To address these challenges, OEMs can adopt a centralized architecture based on high-performance automotive microcontrollers and dedicated power management components. A representative approach is the two-in-one platform from NXP, targeting e-axle and electrification integration, combining inverter and DC/DC control within a unified compute system.

At the core of this solution is a high-performance automotive processing platform from the S32K39 family, paired with a dedicated power management integrated circuit to ensure stable operation under complex load conditions. Power stage control is supported through the GD3162; a dedicated, galvanically-isolated gate driver for SiC or IGBT-based power modules. This combination enables flexible support for both silicon-based and wide-bandgap power devices within the same system architecture.

EV control modules
The evolution of X-in-1 control for e-mobility (Source: NXP)

The software stack is designed around a modular foundation layer that orchestrates multiple application domains within a shared environment. A dedicated software framework enables partitioning of functional domains such as inverter control, DC/DC regulation, and system monitoring. A key feature of this architecture is multi-core isolation, where safety-critical and time-sensitive control loops are separated across processing cores while still operating within a unified chip-level platform. This ensures deterministic control behavior while maintaining isolation between different vehicle functions.

For motor control applications, field-oriented control (FOC) algorithms are implemented to manage traction inverter behavior. These algorithms enable precise torque and speed control, supporting high-efficiency electric drive operation. The platform also includes application-level software components for inverter control, DC/DC conversion, and system-level coordination, enabling a complete electrification control solution.

A graphical interface layer is used for system configuration, monitoring, and diagnostic testing. This interface allows developers to observe system behavior, inject controlled fault conditions, and validate system response under simulated failure scenarios. This capability is particularly important for validating safety mechanisms and system robustness during development and testing phases.

From a system integration perspective, the architecture is designed to reduce bill of materials complexity by consolidating multiple discrete controllers into a single compute and power management platform. This reduces wiring complexity, connector count, and overall system weight while improving integration efficiency. At the same time, software-defined control allows updates and modifications to be made at the application level without requiring hardware redesigns.

To support safety requirements, extended documentation and functional safety design resources are provided to assist in system-level compliance. These resources help guide implementation of safe system partitioning and support analysis of failure modes across integrated subsystems.

Looking forward, next-generation architectures are expected to move toward even higher levels of integration using more advanced automotive processing platforms such as future S32K5-based systems.

These platforms will enable further consolidation of electrification functions, increasing the number of subsystems integrated into a single control unit while improving computational isolation and system efficiency.

This evolution supports a trajectory toward highly integrated electrified propulsion systems where multiple vehicle domains are managed within a unified, scalable compute architecture.

About Author

 generic graphic of person
Miguel Tapia, Transportation Supplier Corporate Account Manager

Miguel Tapia has over 25 years of experience in the semiconductor industry, currently serving as Avn...

Marketing Content Spots

Related Articles

Related Articles
Digital bar chart rising from a semiconductor chip on a circuit board, representing growth in AI and semiconductor markets.
The Next Wave of AI: Building for the Edge in a Changing Semiconductor Market
By Alex Iuorio   -   July 21, 2026
Edge AI is entering its next growth phase, creating new opportunities for embedded innovation while increasing the importance of supply-chain planning, component strategy, manufacturability, and long-term product support.
Thermal imaging camera measuring heat on an electronic circuit board.
Power, Thermal, and Compute Constraints
By Avnet Staff   -   July 20, 2026
A device may achieve impressive benchmark results yet struggle under real operating conditions. Learn how power, thermal and compute constraints shape successful Edge AI designs.

Related Events

Related Events
airplane cockpit looking out on the runway
More Electrification in Aircraft
Date: October 11, 2022
Location: Virtual

how-the-ev-drivetrain-is-moving-toward-function-consolidation