Digi XBee for Wi-SUN®
With over 100 million devices already deployed in the field, Wi-SUN® revolutionizes how smart cities, utilities, buildings and industrial networks connect devices with secure IP-based wireless mesh networking that scales from sites to neighborhoods to entire regions.
Features and Benefits
- Built on Silicon Labs EFR32FG2x SoCs highest level of Secure Vault™
- Full Function Node (FFN) and Leaf Node (LFN) modules to provide cost and performance optimized options
- Support for FSK data rates from 30 up to 500 Kbps (LFN/FFN) and OFDM data rates from 12 Kbps up to 2.4 Mbps (FFN)
- Leaf Node supports battery-powered applications with up to 10-15 years of battery life1
- Leaf Node with Bluetooth LE for optional provisioning and sensor connectivity capabilities4
- Up to 16 dBm transmit power for FFN nodes, up to 20 dBm transmit power for Leaf nodes2
- On-module edge intelligence and local control with custom MicroPython applications
- Local interface support for GPIO, I2C, SPI, and UART
- Pre-injected certificates for simplified PKI deployment and management3 using Wi-SUN Alliance® approved Root CA
- Industrial operating temperature range of -40 °C to 85 °C
- Simplified global deployment with regulatory approvals for US, Canada, Europe, India, and Japan
- Cisco OpenCSMP4 support for seamless integration into existing field network management infrastructures
- Wi-SUN CERTIFIED™ for proven FAN 1.1 standard compatibility with the broader Wi-SUN ecosystem
1Depending on use cases and duty cycle requirements.
2PRO version with up to 30 dBm (1W) planned. Contact us for additional information.
3Customer-specific certificate options available.
4Coming soon.
