238005-1

AMPMODU* Mod.I Interconnection System,
Receptacle Contact

Product Type FeaturesPCB Mounting Orientation? VerticalMake First / Break Last? NoApplies To? Wire/CableWith Insulation Support? YesApplied Pressure? HighProduct Type? ContactBody FeaturesBody Style? StraightContact FeaturesContact Type? SocketContact Mating Area Plating Material? TinContact Angle? StraightContact Current Rating?(A) 5Contact Mating Area Plating Thickness .762?µm?[?30?µin?]Contact Base Material? Phosphor BronzeTermination FeaturesTermination End Plating Thickness .762?µm?[?30?µin?]Termination End Plating Material? TinMechanical AttachmentPCB Mount Retention? WithoutDimensionsWire Range .3 – .9?mm²?[?22 – 18?AWG?]Insulation Diameter 1.8 – 2.3?mm?[?.071 – .091?in?]Packaging FeaturesPackaging Method? Loose PiecePackaging Quantity? 2000