LD08HA100JAB1A

This termination is indicated by the use of a “B” in the 12th position of the Catalog Part Number. This fulfills commitment to providing a full range of products to our customers. It has provided in the following pages, a full range of values that we are offering in this “B” termination.Larger physical sizes than normally encountered chips are used to make high voltage MLC chip product. Special precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during heating or cooling cycles should not exceed 4°C per second. The preheat temperature must be within 50°C of the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing.For 1825, 2225 and 3640 sizes, offers leaded version in either thru-hole or SMT configurations.