C2220C334MBR2CAUTO

KEMET Power Solutions (KPS) High Voltage stacked capacitors utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitor(s) from the printed circuit board, thereby offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible microphonic noise that may occur when a bias voltage is applied. A two-chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Providing up to 10 mm of board flex capability.

• AEC-Q200 automotive qualified
• Reliable and robust termination system
• Provides up to 10 mm of board flex capability
• Higher capacitance in the same footprint
• Board space savings
• Reduces audible microphonic noise
• Extremely low ESR and ESL