Facilitating the future of Defense and Aerospace technology

As a global manufacturer of a broad line of electronic interconnect solutions, Samtec is uniquely qualified to provide rugged and durable high-performance interconnect for mission-critical military and aerospace electronics.

As system interconnect requirements change from concept to prototype to final product, Samtec’s flexible design approach and robust testing practices provide engineers the perfect combination for application-specific interconnect solutions.  Off-the-shelf solutions tested to specific, rugged criteria often times are the ideal interconnect solution when time-to-market is critical

As Low-SWaP and density requirements become more prevalent, Samtec’s bespoke technical support and unmatched customer service offer military and aerospace engineers a trusted design partner.  Whether increased mating cycles, EMC shielding, shock and vibration, or other specific requests, Samtec commitment to high quality, ruggedness and scalable manufacturing are ideally suite for mil/aero applications.

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FireFly™ Micro Flyover System™ is the first interconnect system that gives a designer the flexibility of using micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system.

ETUO Series - FireFly™ Extended Temperature Active Optical Micro Flyover Cable Assembly

  • Extended temperature range from -40 ºC to +85 ºC
  • Supports up to 10.3125 Gbps per channel (12.5 Gbps in development)
  • Data connection is taken "off board" for easier routing
  • Integral heat sink provides optimal cooling for thermal operating conditions
  • Variety of fiber type and End 2 options
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Samtec's ETUO Series - FireFly™ Extended Temperature Active Optical Micro Flyover Cable Assembly

 

UCC8 Series - FireFly™ Positive Latching Receptacle

  • Power and low-speed control signal communications
  • Available in 10 positions
  • Selective gold-plated contacts
  • Standard alignment pins and weld tabs
  • Part of the 2-piece connector set for FireFly™ optical and copper systems
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Samtec's UCC8 Series - FireFly™ Positive Latching Receptacle

UEC5-1 Series - Up To 20 Gbps FireFly™ Edge Card Socket Assembly

  • Rugged Edge Rate® contact system
  • Low profile right-angle design
  • Available in 19 positions
  • Standard alignment pins and surface mount tails
  • Selective gold-plated contacts
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Samtec's UEC5-1 Series

 

Resource document:

Extended Temperature FireFly™ eBrochure

HLCD Series - 0.50 mm Razor Beam™ High-Speed Hermaphroditic Coax Cable Assembly

  • 0.50 mm (.0197") pitch
  • 50 ohm single-ended signal routing over 38 AWG coax cable
  • Double row design up to 100 pins
  • Optional screw downs for rugged applications
  • Mates with LSHM series connectors double row design up to 100 pins
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Samtec's HLCD Series - 0.50 mm Razor Beam™ High-Speed Hermaphroditic Coax Cable Assembly

 

LSHM Series - 0.50 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

  • Audible click when mated
  • Parallel, perpendicular and coplanar systems
  • Up to 100 I/Os in stack heights from 5.00 mm to 12.00 mm
  • Shield and lubricated options available
  • Mates with HLCD series cable assemblies
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Samtec's LSHM Series - 0.50 mm Razor Beam™ High-Speed Hermaphroditic Terminal/Socket Strip

 

Resource document:

Razor Beam™ eBrochure

SMA 50 OHM – Subminature interconnects with screw-type coupling

  • Performance up to 6 GHz
  • Available in a wide variety of cable assemblies
  • Available in a wide variety of orientations and PCB terminations
  • Non-magnetic options available for medical and aerospace applications
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An example of Samtec's subminature interconnect

 

AES-LPA-502-G – RF Breakout Daughtercard for Zynq UltraScale+ ZCU111

  • J333 LPAM-40-01.0-S-08-2-K-TR – ADC
  • J888 LPAM-40-01.0-S-08-2-K-TR – DAC
  • Supports carrier frequencies ≥ 20 GHz
  • Leverages Samtec RSP-208784-01 screw-mount, straight SMA plug
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RF Breakout Daughtercard for Zynq UltraScale+ ZCU111

 

Resource documents:

Precision RF Interconnects Roadmap

AES-LPA-502-G Product Brief

Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.

SEAM Series - .050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

  • Up to 560 I/Os with .050" (1.27 mm) pitch
  • 56 Gbps PAM4 performance
  • Solder charge termination
  • Stack heights from 7.00 mm - 18.50 mm
  • Meets IPC J-STD-001F and IPC-A-610F Class 3 criteria
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Samtec's SEARAY™  SEAF/SEAM series

 

SEAF Series - 050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Socket

  • Up to 560 I/Os with .050" (1.27 mm) pitch
  • 56 Gbps PAM4 performance
  • Solder charge termination
  • Stack heights from 7.00 mm - 18.50 mm
  • Meets IPC J-STD-001F and IPC-A-610F Class 3 criteria
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Samtec's SEARAY™  SEAF/SEAM series

 

VITA 74 VNX Compliant SEARAY™ Connectors

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Samtec's VITA 74 VNX Compliant SEARAY™ Connectors

 

Resource documents:

SEARAY™ eBrochure

Severe Environment Testing (SET)

Severe Environment Testing (SET) is a new Samtec initiative to test products beyond typical industry standards and specifications, many set forth by common requirements for rugged industries. These additional tests help bridge the gap for standard qualification testing on a COTS product, and a full Mil-Spec product. SET ensures Samtec’s customers that COTS products are suitable for use in industrial, military, automotive and other extreme applications.

  • Higher Mating Cycles with 100% Humidity • Intense Shock and Vibration: LLCR & Event Detection
  • Temperature Cycling • Non-Operating Class Temperature
  • DWV at Altitude • Electrostatic Discharge (ESD)

Resource Document: Samtec Testing Quick Reference sheet

Samtec's Severe Environment Tested badge

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High-Performance Interconnect for Def/Aero Applications

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Brochure

Samtec offers flexibility in Military/Aerospace Applications through COTS parts and Samtec provides engineers and designers cost-effective COTS solutions with short lead-times.

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Design guide

Use micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system.

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