Laird Tflex™ CR550 Two-Part Liquid Gap Filler
Dispensable thermal gap filler for automotive electronics
Tflex™ CR550 from Laird™ is a two-part liquid dispensable thermal gap filler designed to efficiently transfer heat away from high-power electronic assemblies. Engineered for applications such as onboard chargers, control boxes, DC-DC converters, inverters, and power modules, it helps improve thermal management in demanding automotive and industrial environments.
Combining mid-range thermal conductivity with vertical stability, Tflex CR550 supports thermal performance requirements while helping control material costs. Its demonstrated thermal and vibration stability makes it well-suited for electronics exposed to challenging operating conditions.
For manufacturing operations, Tflex CR550 delivers excellent dispensing characteristics and is compatible with standard dispensing equipment, helping simplify production processes and support high-throughput assembly. The material is available in multiple cartridge and bulk packaging options to accommodate a range of prototyping and production requirements.
Features
- Two-part liquid dispensable thermal gap filler
- Thermal conductivity of 5.4 W/mK
- Demonstrated thermal and vibration stability
- Flows easily through standard dispensing equipment
- RoHS, REACH, lead-free, and UL 94 V-0 compliant
Benefits
- Helps transfer heat away from high-power electronic assemblies
- Supports reliable performance in vibration-prone environments
- Simplifies manufacturing with excellent dispensing behavior
- Compatible with existing dispensing equipment, reducing process complexity
- Available in multiple package sizes to support both development and volume production
Applications
- Helps transfer heat away from high-power electronic assemblies
- Supports reliable performance in vibration-prone environments
- Simplifies manufacturing with excellent dispensing behavior
- Compatible with existing dispensing equipment, reducing process complexity
- Available in multiple package sizes to support both development and volume production
Datasheet
Tflex CR550 Soft Thermal Gap Filler Pad
High-performance thermal gap filler material designed to transfer heat between components and heat sinks while conforming to uneven surfaces. Suitable for electronics thermal management applications.