Hirose Electric FX36 Series
0.5 mm-pitch floating board-to-board connector
The Hirose Electric FX36 Series is a compact, 0.5 mm-pitch floating board-to-board connector engineered for automotive and industrial systems exposed to vibration and PCB movement. Its floating structure absorbs misalignment of up to ±0.7 mm in both the X and Y directions, with an effective mating length of ±0.5 mm in the Z direction.
A two-point contact system and vibration-absorbing design help maintain stable electrical connections in demanding operating environments. Rated for temperatures from -40°C to +125°C, the connector supports applications including EV and HEV powertrains, inverters, converters, on-board chargers, electric power steering, and industrial machinery.
The series supports 40, 50, 60, and 80 positions, with 15 mm, 18 mm, and 20 mm stacking-height options. Its compact footprint enables high-density layouts and space-efficient board-to-board integration. Product configurations and availability vary by position count and stacking height.
Features
- Compact 0.5 mm pitch for dense layouts
- Floating movement of ±0.7 mm in X and Y
- Effective mating length of ±0.5 mm in Z
- Two-point contact system for connection reliability
- Operating temperature range from -40°C to +125°C
Benefits
- Absorbs PCB misalignment during assembly and operation
- Helps maintain stable connections under vibration
- Supports space-saving, high-pin-count PCB designs
- Offers flexible 15, 18, and 20 mm heights
- Suits harsh automotive and industrial environments
Applications
- EV and HEV powertrain systems
- Inverters, converters, and on-board chargers
- Automotive electric power steering systems
- Agricultural and construction machinery
- Other high-vibration industrial equipment
Datasheet
Hirose FX36 0.5mm Floating Board-to-Board Connectors
0.5mm-pitch floating board-to-board connectors for 15, 18, or 20mm mated heights. The FX36 Series supports ±0.7mm X/Y misalignment, absorbs 0.05mm PCB amplitude, and operates to 125°C in high-vibration powertrain applications.
