Hirose Electric IT18 Series
COM-HPC® Standard Compatible, Ultra High Density, Low Profile, BGA Mezzanine Connector
As AI and high‑performance edge computing push COM‑HPC® architectures to higher speeds and densities, interconnect reliability and signal integrity become critical design challenges. Hirose’s IT18 Series mezzanine connector addresses these demands with a COM‑HPC®‑compliant, 0.635mm‑pitch design offering 400 positions and support for PCIe® Gen5, Gen6 (PAM4), and 100Gb Ethernet. Available in 5mm and 10mm stacking heights, the IT18 provides layout flexibility through an open pin‑field, while a BGA pin‑in‑ball structure enhances solder joint reliability—making it ideal for next‑generation embedded computing, servers, and industrial edge systems.
Key Features
- COM‑HPC®‑standard mezzanine connector designed for next‑generation high‑performance embedded computing systems.
- High‑speed connector supporting PCIe® Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4), and 100Gb Ethernet (4×25Gb) for data‑intensive applications.
- Ultra‑fine 0.635mm pitch mezzanine connector with 400 signal positions, enabling high‑density interconnects in compact PCB designs.
- Flexible 5mm and 10mm stacking heights with an open pin‑field layout, allowing optimized PCB routing and board‑to‑board design flexibility.
- BGA ball attachment with pin‑in‑ball construction, delivering high mounting reliability and robust solder joints for demanding environments.
Applications
- Industrial Automation
- Medical Imaging
- Mil-Aero
Video: Hirose Electric Presents IT18 Series
Product Brief
Hirose IT18 Series
Learn how the Hirose IT18 Series delivers high density COM HPC® connectivity with PCIe Gen5/Gen6 and 100GbE performance in a compact 0.635mm pitch design.
Product Catalog
Hirose IT18 Series
Download the IT18 Series catalog for detailed specifications, part numbers, dimensions, and signal integrity data to support your COM HPC® design.