Hirose BK35 High-Speed FPC-to-Board Connector

The Hirose BK35 Series is a fully shielded, power/signal hybrid FPC-to-board connector designed for high-speed, space-constrained electronic systems. Featuring a 0.35 mm pitch, 0.6 mm stacking height, and compact 2.2 mm depth, the connector helps maximize PCB space while combining power delivery and signal transmission in a single interface.

Available with 16, 30, or 56 signal contacts and four 2.5 A power contacts, the BK35 reduces connector count and simplifies board routing. The connector supports data transmission speeds up to 40 Gbps and RF signal transmission up to 40 GHz, delivering excellent signal integrity for next-generation designs.

A fully shielded structure helps suppress EMI and reduce noise, while the armored housing improves mating reliability and durability. With gold-plated contacts and an operating temperature range of -55°C to +85°C, the BK35 Series is well suited for laptops, tablets, smartphones, smart glasses, and other compact high-speed electronic devices. Click or tap here to enter text.

Features

• 0.35 mm pitch, 0.6 mm stacking height
• Fully shielded connector design
• Hybrid power/signal architecture
• Four 2.5 A power contacts
• Up to 40 Gbps data transmission
• RF performance up to 40 GHz
• 16-, 30-, or 56-position signal options
• Fully armored housing
• Gold-plated contacts
• -55°C to +85°C operating range

Benefits

• Saves valuable board space
• Combines power and data in one connector
• Reduces connector count
• Simplifies PCB routing
• Minimizes EMI and noise
• Preserves signal integrity
• Supports high-bandwidth designs
• Improves mating reliability
• Enhances long-term durability
• Enables compact, high-density systems

Applications

• Laptops
• Tablets
• Smartphones
• Smart glasses
• Wearables
• Portable electronics
• High-speed computing systems
• RF communication equipment
• Board-to-board interconnects
• Board-to-FPC interconnects