Phoenix Semiconductor XCFxxP/S-PSC Platform Flash PROMs
A New Solution for Discontinued Chips: Phoenix Semiconductor Recreates the XCF Platform Flash PROM
The XCFxxP/S-PSC is an 1/2/4/8/16/32-Mbit Platform Flash PROM designed to store and deliver FPGA configuration data for Xilinx FPGA devices. It provides a non-volatile, reprogrammable solution that supports multiple configuration modes and is optimized for high-density FPGA designs. The XCFxxP/S-PSC provides a scalable configuration solution for large and complex FPGA-based systems, ensuring reliable device initialization across a broad range of applications including communications, industrial, and defense electronics.
Features:
- Memory Capacity: 1/2/4/8/16/32 Mb non-volatile Flash, sector-erasable and reprogrammable.
- Design Revisions: Up to four independent configuration images (REV 0 – 3).
- Revision Selection: Controlled via internal control bits or external pins EN_EXT_SEL, REV_SEL[1:0].
- Configuration Modes: Serial (x1) or Parallel (x8) output; Master or Slave operation.
- Clock Source: Selectable internal oscillator (25 – 50 MHz) or external CLK input.
- Cascading Support: CEO / CE interconnect enables multi-PROM daisy-chain configuration
- In-System Programmability: JTAG (IEEE 1149.1) program, erase, verify, and readback.
- Security: Non-volatile lock bits disable further programming when set.
- Data Retention & Reliability: Non-volatile flash technology ensuring data retention >20 years, and high endurance for repeated programming cycles.
- Low Power: Standby mode for reduced power consumption during system idle states
- Industrial temperature range: −40 °C to +85 °C.
- RoHS-compliant and Pb-free package options.
Package Options:
- The DFN2012D-48 package is a dual flat no-lead design, optimized for thermal performance and low-inductance electrical connections. It is functionally equivalent to the VOG48 package.
- The BGA0809D-48 package is a fine-pitch ball grid array, providing enhanced board-level reliability and high-frequency electrical performance. It is functionally equivalent to the FSG48 package.
- The DFN6P56P4D-20 package is a dual flat no-lead design, optimized for thermal performance and low-inductance electrical connections. It is functionally equivalent to the VOG20 package.
XCFxxP/S-PSC Platform Flash In-System Programmable Configuration PROMs Product Brief
Phoenix has developed a proprietary process for recreating discontinued chips without requiring new silicon, a fabrication facility, or original wafers. This innovation enables Phoenix to produce drop-in replacements that are seamless, fast to market, and ideally suited for long-life programs requiring a high mix of parts in lower volumes.
