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Phoenix Semiconductor XCFxxP/S-PSC Platform Flash PROMs

A New Solution for Discontinued Chips: Phoenix Semiconductor Recreates the XCF Platform Flash PROM

Phoenix Seminconductor XCF Platform Flash PROM

The XCFxxP/S-PSC is an 1/2/4/8/16/32-Mbit Platform Flash PROM designed to store and deliver FPGA configuration data for Xilinx FPGA devices. It provides a non-volatile, reprogrammable solution that supports multiple configuration modes and is optimized for high-density FPGA designs. The XCFxxP/S-PSC provides a scalable configuration solution for large and complex FPGA-based systems, ensuring reliable device initialization across a broad range of applications including communications, industrial, and defense electronics. 

 

Features:

  • Memory Capacity: 1/2/4/8/16/32 Mb non-volatile Flash, sector-erasable and reprogrammable.
  • Design Revisions: Up to four independent configuration images (REV 0 – 3). 
  • Revision Selection: Controlled via internal control bits or external pins EN_EXT_SEL, REV_SEL[1:0]. 
  • Configuration Modes: Serial (x1) or Parallel (x8) output; Master or Slave operation. 
  • Clock Source: Selectable internal oscillator (25 – 50 MHz) or external CLK input. 
  • Cascading Support: CEO / CE interconnect enables multi-PROM daisy-chain configuration 
  • In-System Programmability: JTAG (IEEE 1149.1) program, erase, verify, and readback. 
  • Security: Non-volatile lock bits disable further programming when set. 
  • Data Retention & Reliability: Non-volatile flash technology ensuring data retention >20 years, and high endurance for repeated programming cycles. 
  • Low Power: Standby mode for reduced power consumption during system idle states 
  • Industrial temperature range: −40 °C to +85 °C. 
  • RoHS-compliant and Pb-free package options. 

Package Options:

  • The DFN2012D-48 package is a dual flat no-lead design, optimized for thermal performance and low-inductance electrical connections. It is functionally equivalent to the VOG48 package. 
  • The BGA0809D-48 package is a fine-pitch ball grid array, providing enhanced board-level reliability and high-frequency electrical performance. It is functionally equivalent to the FSG48 package. 
  • The DFN6P56P4D-20 package is a dual flat no-lead design, optimized for thermal performance and low-inductance electrical connections. It is functionally equivalent to the VOG20 package. 

 

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XCFxxP/S-PSC Platform Flash In-System Programmable Configuration PROMs Product Brief

Phoenix has developed a proprietary process for recreating discontinued chips without requiring new silicon, a fabrication facility, or original wafers. This innovation enables Phoenix to produce drop-in replacements that are seamless, fast to market, and ideally suited for long-life programs requiring a high mix of parts in lower volumes.