As automotive platforms transform into sophisticated digital ecosystems, engineers are tasked with embedding high-tech electronics without inflating vehicle mass, footprint, or sacrificing functionality.
Molex’s miniaturized automotive interconnects tackle these constraints head-on, delivering streamlined, lightweight connections that uphold system integrity and overall performance.
ConnTAK50 Connectors
1.80mm-pitch that employs the Arbeitskreis (AK) interface with both single-row and dual-row versions.
See ConnTAK50
DuraClik Connector System
2.00mm-pitch wire-to-board connectors provide stable mating and high PCB retention force for high vibration applications.
See Duraclik
High-Speed FAKRA-Mini (HFM) Interconnect System
Data rates up to 28Gbps at frequencies up to 20 GHz in a compact, lightweight form factor for rugged reliability and space efficiency.
See HFM
Mizu Connectors
Wire-to-wire connector systems maintain signal integrity between sensitive vehicle parts in harsh, wet environments.
See Mizu
Nano-Fit Connectors
High-performance connector, designed for space efficiency and reliability.
See Nano-Fit
Pico-Lock Connectors
Space saving, low profile, high-current carrying capability and durable locking wire-to-board connector system.
See Pico-Lock
SlimStack Board-to-Board Connectors
0.35mm to 1.25mm board connectors with space-saving flexibility.
See SlimStack
Stac64 Connector System
Stackable connection system with single and multi-pocket PCB solutions, offering a diverse range of circuit sizes.
See Stac64
stAK50h Unsealed Connection System
Through-hole style unsealed headers and connectors to support stringent global automotive OEM requirements.
See stak50h
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Explore Molex's full range of innovative connectivity solutions, from ADAS Interconnects and Next Generation EV Technology to Interior Experience enhancements.
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