Y1629120R000Q9R

Based on VFR’s Bulk Metal Z-Foil technology, the VFCP Series (foil resistor flip-chip) excels over all previous stability standards for precision resistors with an order of magnitude improvement in high-temperature stability, load-life stability, and moisture resistance. These new benchmark levels of performance provide design engineers with the tools to build circuits not previously achievable while reducing costs and space in the most critical applications by eliminating the need for corrective circuitry and reducing the large land patterns needed for a wrap-around configuration. The device’s flip-chip configuration saves up to 35% PCB space compared with a surface-mount chip with wraparound terminations while also providing better strain relief to eliminate cracked substrates and board delamination.

In addition to its remarkably improved load-life stability, the VFCP Series is noise-free and provides ESD protection of 25 kV or more for increased reliability. The device’s solid element alloy is matched to the substrate, forming a single entity with balanced resistance versus temperature characteristics for an unusually low and predictable TCR over a wide temperature range from –55°C to more than +125°C. The adhesive that holds the foil to the flat substrate withstands high temperatures, pulsing power, moisture incursions, shock and vibration, and low-temperature exposure while still holding securely to the foil element. Resistance patterns are photo-etched into the element to permit the trimming of resistance values to very tight tolerances as low as 0.01%.

The Flip Chips devices are qualified as anti-sulfurated resistors for use in environments with high levels of contamination. Such environments include alternative energy applications, industrial control systems, sensors, RTDs, electric instrumentation, weather and communication base stations, and any electronic appliance used in high concentrations of sulfur. The combination of flip-chi

• Temperature coefficient of resistance (TCR): ± 0.2 ppm/°C typical (–55°C to +125°C, +25°C ref.)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “?R due to self heating” 5 ppm at rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 ? to 125 k?
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of steady state value)
• Short time overload: =0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 µVrms / V of applied voltage (<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 µH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC
• Matched sets are available per request