5120790-1

The Z-PACK HS3 connector system has been specifically designed to support this generation of high speed serial data transfer.

Compliant pins are used on both daughter-card and backplane.

This connector family is press fit and is compatible with other Z-PACK HM family connectors on the same board edge. Z-PACK HS3 connectors support data rates of 6.2+ Gb/s per differential pair. The 10 row version is optimized for high density for 25.4mm or 1.0 inch card centerline applications.

• 100-Position Right Angle Receptacle, Center Module
• High speed, high density two piece board-to-board backplane connector
• Dual beam provides redundant contact for improved reliability
• For data rates of 6.2+ Gb/s
• 10 row, 100 high speed lines per 25.00 [.984]
• Controlled impedance: 50 ohm Single Ended 100 ohm Differential
• Feedthrough versions for midplane applications
• 250 mating cycles
• End stackable on 2.50 [.098] centerline, signal pin to signal pin
• Advanced ESD/Power (10 Amps) using optional guide pins and power contacts