5-650281-1

The high performance AMP TELEDENSITY connector is a high density, card edge, telecommunications connector. It features compliant ACTION PIN contacts for solderless application to multi-layer printed circuit boards with plated-through or bare copper holes.

These connectors accept 0.054 to .072 [1.37 to 1.83] thick daughter cards. To satisfy the broadest range of application needs, the contacts are plated with 30 micro inches of gold in the mating area and tin-lead on the posts. A plastic locating strip keeps posts positioned correctly for board insertion.

• High density 0.0625 [1.586] contact centerlines
• Compliant ACTION PIN contacts press-fit into plated-through holes for solderless application
• Individually replaceable contacts
• Accommodates up to three levels of daughter card pads for sequencing
• 0.125 [3.18] square grid post arrangement