2-5353512-0

0.5mm Fine Stack and Fine Mate product lines are economical, surface-mount, ultrafine pitch board-to-board connectors. Both product lines have been developed to meet the latest needs of the electronic industry for high density packaging.

These connectors offer a 0.5 [.020] contact pitch and parallel board stacking heights as low as 1.5 [.059] for Fine Stack connectors and ranging from 4.5 [.177] to 6.0 [.236] for Fine Mate connectors. They are ideally suited for applications requiring miniaturization, such as cellular phones, pagers, notebook computers, camcorders and other consumer electronics.

Both Fine Stack and Fine Mate connectors were designed for economical, automatic placement onto SMT printed circuit boards. The tab and receptacle designs include surface areas to accommodate “pick and place” vacuum nozzles without secondary covers. All products are “tape and reel” packaged, conforming to EIAJ standards.

• Ultra fine, 0.5 [.020] pitch SMT connectors for board to-board interconnections
• Low profile parallel board stacking heights as low as 1.5 [.059]
• Horizontal versions available for right angle board-to-board applications
• Surface areas provided to accommodate vacuum nozzles
• Available packaged in tape and reel for automatic placement per EIAJ standards
• Offered with tin or gold plating on mating surfaces
• Solder pegs are included for anti-peeling