1934271-1

The Z-PACK TinMan backplane connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.

Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels. Reliability is provided with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

• 5-pair 8-column Vertical Header Assembly - Double End Walls
• 10+ Gbps performance
• 100 ohm Impedance for Differential-pair configuration
• Offers 26-pairs/10mm [66 differential-pairs/inch] fitting within a 25.40 [1.00] card slot pitch
• Reliable, redundant contact design on every signal contact
• Meets Industry reliability requirements of Bellcore/Telcordia
• Sequencing for ground and signal contacts