1761617-5
Conn High Density RCP 296 POS 1.3mm Solder ST Thru-Hole Tray
- RoHS 10 Compliant
- Tariff Charges
The STEP-Z connector is a grid array mezzanine connector specifically designed for high speed and high density applications up to 10+ gigabit per second data rates. Pin out patterns for either differential pair or single ended provide excellent isolation of high speed signals. Ground connections in close proximity to signal connections enable proper electrical coupling through the entire interconnect dramatically reducing crosstalk. The connector system maintains a 100 ohm impedance for differential applications and a 50 ohm impedance for single ended applications throughout the interconnect.
- 296-position STEP-Z Interconnection Receptacle
- Excellent electrical performance for applications requiring 10+ Gb/s data rates
- Multipair differential cross talk less than 3% at 100 PS rise time for all stack heights
- Impedance specification of 100 ohms for Differential-pair configuration and 50 ohms for Single-Ended configuration
- SMT BGA attachment
- Dual beam signal contacts for high reliability
- Receptacle contacts fully protected with plastic cover
- Polarized housing design
- Packaging available for Trays
- High temperature housing plastic
- Caps for use with vacuum pick & place equipment
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| Thermoplastic | ||
| Straight | ||
| Copper Alloy | ||
| Gold | ||
| Receptacle | ||
| Tin-Lead | ||
| 245 | ||
| Through Hole | ||
| -65 to 125 °C | ||
| 1.3000 mm | ||
| Solder |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8536694040 |
| Schedule B: | 8536694040 |