1-5750913-9

Shielded AMPLIMITE .050 Series headers with ACTION PIN contacts offer a high-density D type interface, and a solderless board-mount interconnection. These vertical mount headers are available in 20, 26, 50, 68 and 100 contact sizes. Choice of configurations includes; headers with rails and latch blocks, with latch blocks only, and without rails and latch blocks.

ACTION PIN contact tails are available in two lengths; .173 [4.39] for pc boards with a nominal thickness of .062 [1.56] to .093 [2.36], and .280 [7.11] for pc boards with a nominal thickness of .125 [3.18] to .200 [5.08].

AMPLIMITE .050 Series headers with ACTION PIN contacts are compatible with SCSI-2, SCSI-3, EIA RS-232, IPI-2 and HIPPI standards.

When an AMPLIMITE .050 Series compliant ACTION PIN contact is inserted into a platedthrough-hole, two spring members are compressed, exerting force against the hole for a gas-tight connection. The diameter of the hole is smaller than the diagonal size of the pin

The beam characteristics of the pin are designed so that a plastic, as well as an elastic, deformation takes place during insertion. The two spring members compress to different degrees to accommodate hole tolerances. The compliant pin also reduces strain on the board. With a rigid pin, the elastic strain energy is stored entirely in the board, leading to damage of the platedthrough holes. With the AMPLIMITE .050 Series compliant ACTION PIN contact, the residual force of the elastic deformation maintains stored energy to produce a gas-tight contact zone between the pin and the plated-through-hole. This ensures long term electrical and mechanical reliability of the interconnection.

• Recognized under the Component Program of the Underwriters Laboratories, Inc., File No. E28476
• Certified by Canadian Standards Association, File No. 1088108 (LR 7189A-207)
• Produced under a Quality Management System certified to ISO 9001