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71V35761SA166BGG

3.3V 128K x 36 Synchronous PipeLined Burst SRAM w/3.3V I/O

Manufacturer:Renesas Electronics
Product Category: Memory, SRAMs
Avnet Manufacturer Part #: 71V35761SA166BGG
Secondary Manufacturer Part#: 71V35761SA166BGG
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The IDT71V35761SA is a high-speed SRAMs organized as 128K x 36. The IDT71V35761SA SRAMs contain write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as the IDT71V35761SA can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will be pipelined for one cycle before it is available on the next rising clock edge. If burst mode operation is selected (ADV=LOW), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin. The IDT71V35761SA SRAMs utilize a high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA) and 165 fine pitch ball grid array(fBGA).

  • 128K x 36 memory configurations
  • Supports high system speed:
    • Commercial: 200MHz 3.1ns clock access time
    • Commercial and Industrial: 183MHz 3.3ns clock access time
    • 166MHz 3.5ns clock access time
  • LBO input selects interleaved or linear burst mode
  • 3.3V core power supply
  • Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx)
  • Power down controlled by ZZ input
  • 3.3V I/O
  • Optional - Boundary Scan JTAG Interface (IEEE 1149.1 compliant)
  • Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch ball grid array
  • Green parts available, see ordering information

Technical Attributes

Find Similar Parts

Description Value
17 Bit
Pipelined
166 MHz
SDR
4.5 Mbit
Tin-Silver-Copper
260
166 MHz
320 mA
3.5 ns
4.5 Mbit
Surface Mount
MSL 3 - 168 hours
119
36 Bit
36 Bit
1
128 kWords
0 to 70 °C
70 °C
0 °C
119BGA
119
1.2700
22 x 14 x 1.55 mm
No
Commercial
BGA
3.465 V
3.135 V
3.3 V
Synchronous
3.3000 V

ECCN / UNSPSC / COO

Description Value
Country of Origin: NO RECOVERY FEE
ECCN: EAR99
HTSN: 8542320041
Schedule B: 8542320070
In Stock :  0
Additional inventory
Factory Lead Time: 777 Weeks
Price for: Each
Quantity:
Min:168  Mult:84  
USD $:
168+
$10.74552
336+
$10.6907
672+
$10.63588
1344+
$10.58105
2688+
$10.52623