OSDZU3EG1-2G-HFB

The OSDZU3 is the fastest and most flexible way to develop a system around the AMD Zynq® UltraScale+™ MPSoC. It allows you to harness the performance of the ZU3 MPSoC, while removing the complexities without sacrificing flexibility.
The OSDZU3 simplifies designs utilizing the AMD ZU3 Zynq UltraScale+ MPSoC by integrating a Power Management solution, up to LPDDR4 memory, QSPI memory, and other required components into a single BGA Package that is ~60% smaller than an implementation with discrete chip-down components. The integrated Power Management solution has been customized for the MPSoC and tailored to suit a large range of performance requirements. This integration significantly reduces Engineering time and effort spent on developing applications with ZU3 MPSoC, accelerating time to market by ~9 months and saving significant design costs.

• Integrated into a single BGA Package:
  • ZU3 AMD Zynq UltraScale+ MPSoC
  • Up To 2GB (16Gb) LPDDR4
  • 2x InfineonIRPS5401PMICs
  • 2x LDOs
  • QSPI Flash
  • EEPROM
  • 2x Oscillators
  • Passives
• AMD ZU3 MPSoC Features:
  • 4x Arm® Cortex®-A53 up to 1.2GHz
  • 2x Arm® Cortex®-R5F up to 500MHz
  • Arm® Mali®-400 Based GPU
  • 154K System Logic Cells
  • 141K Flip-Flops
  • 71K CLB LUTs
  • 360 DSP Slices
  • 7.6 Mb Block RAM
• Access to all ZU3 Peripherals
  • PCIe® Gen2, USB3.0, SATA 3.1, DisplayPort, Tri-mode Gigabit Ethernet
  • USB 2.0, SD/SDIO, UART, CAN 2.0B, I2C, SPI
  • 78x MIO
  • 96HD I/O, 156 HP I/O
• Power In: Single 4.5V-5.5V Input
• Power Out: 2x Programmable Buck
• Access to All Power Domains, able to leverage all power modes
• 40mm x 20.5mm BGA Package
• 600 Ball (20 x 30 Grid) 1mm Pitch BGA