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OM13492UL

OM13492 Surface Mount to DIP Evaluation Board

Official logo for NXP
Manufacturer:NXP
Avnet Manufacturer Part #: OM13492UL
Secondary Manufacturer Part#: OM13492UL
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The OM13491 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13491 supports the following packages: SO8 (SOT96), VSSOP8 (SOT765), XQFN8 (SOT902), HWSON8 x 2 (SOT1069), MSOP8 x 2 (SOT505).

  • Easy connection to small surface mount packages
  • Allows evaluation of device that are only available in surface mount packages
  • 100 mil center headers emulate DIP package for easy bread boarding
  • Eliminates costly sockets and custom printed circuit boards
  • Expand the kit with add-on I²C daughter cards
  • Technical Attributes

    Find Similar Parts

    Description Value
    No
    General Tools
    No
    I2C
    Evaluation Board

    ECCN / UNSPSC / COO

    Description Value
    Country of Origin: RECOVERY FEE
    ECCN: EAR99
    HTSN: 9023000000
    Schedule B: 9023000000
    In Stock :  0
    Additional inventory
    Factory Lead Time: 777 Weeks
    Price for: Each
    Quantity:
    Min:1  Mult:1  
    USD $:
    1+
    $20.2664
    2+
    $20.163
    4+
    $20.0596
    8+
    $19.9562
    16+
    $19.8528