MPC8270CVRMIBA
Microprocessor, MPC82xx Series, 266 MHz, 32bit, 32KB, 1.45 V to 1.6 V, BGA-516
- RoHS 10 Compliant
- Tariff Charges
Introducing the next generation of PowerQUICC II processors: the MPC8270, MPC8275 and MPC8280. Utilizing Freescale's HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture. The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Freescale's PowerQUICC II processors include a high-performance embedded 603e core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family. A range of performance and package options Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards. The next gener
- 266 MHz CPU, 200 MHz CPM, 66 MHz bus
- ~ 1W @ full performance, 1.5V
- HIP7AP .13 micron, 3.3V I/O, 1.5V Core
- 516 PBGA, 27x27mm, 1mm ball pitch
- ZQ package has lead-bearing spheres
- VR package is lead-free
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 32 Bit | ||
| FBGA | ||
| Surface Mount | ||
| PowerQUICC II | ||
| 1 | ||
| 516 | ||
| 266 | ||
| 105 °C | ||
| -40 °C |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | NO RECOVERY FEE |
| ECCN: | 3A991.A.2 |
| HTSN: | 8542310070 |
| Schedule B: | 8542310075 |