PAH-48/8.5-D48NB1-C

These compact modules measure 2.3" X 2.4"" X 0.5"" (58 X 61 X 12.7mm) and offer the industry-standard half brick footprint.The PAH Series is ideal for power amplifier applications, semiconductor test equipment, wireless networks, and telecom applications. The baseplate provides a means for conduction cooling in demanding thermal environment conditions.The module provides a 53Vdc or 48Vdc output at 8.5 Amps and accepts a wide input voltage range of 36-75Vdc. The PAH topology offers high efficiency (up to 94%), tight line and load regulation, low ripple/noise, and a fast dynamic load response. A single-board, highly optimized thermal design contributes to the superior thermal performance.These half-bricks provide output trim, sense pins, and primary side on/off control. Standard features also include input under-voltage shutdown, output over-voltage protection, output short-circuit/ current limiting protection, and thermal shutdown."

• Wide Vout trim range (see specifi cations)
• Industry standard “half brick” package
• High efficiency: up to 94%
• Outstanding thermal performance
• Standard baseplate for conduction cooled applications
• No output reverse conduction
• Input to output isolation, 2250Vdc (Basic)
• Input under-voltage lockout
• On/off control (positive or negative logic)
• Output over-voltage protection
• Thermal shutdown
• Output short circuit protection (hiccup technique)
• Certifi ed to UL/60950-1, CSA-C22.2 No. 60950-1, 2nd edition safety approvals