LDB215G3710C-001
Chip Multilayer Hybrid Baluns 6-Pin
Manufacturer:Murata
Product Category:
RF & Wireless, Other RF & Wireless
Avnet Manufacturer Part #: LDB215G3710C-001
Secondary Manufacturer Part#: LDB215G3710C-001
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RoHS 10 Compliant -
Tariff Charges
Chip Multilayer Type: SMD baluns constructed with a copper conductor and ceramic material. Ideal for high-frequency applications. Small-size and low-loss baluns can be customized for balance impedance of 50O to 200O.
Technical Attributes
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| Description | Value |
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ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | 5A991.G |
| HTSN: | 8536509065 |
| Schedule B: | 8536509065 |
Factory Lead Time: