47948-0001

Developed with the power and precision of Laser Direct Structuring (LDS) technology. The lightweight Molded Interconnect Device (MID) chip antenna weighs only 0.03g and is used in portable electronic devices based on Bluetooth*, Wi-Fi**, ZIGBEE† and other wireless standards. These devices include tablet PCs, headsets, smart meters and more. Measuring only 3.00mm by 3.00mm by 4.00mm (0.118" by 0.118"" by 0.157"") and used on one side of the PCB, the antenna allows board makers to realize significant PCB real estate savings by leaving the ground layers in the PCB intact while freeing up space on the reverse side of the PCB for other component assemblies. This monopole antenna has an omni-directional radiation pattern and requires only simple stripline matching on the PCB, without the need for discrete components. It is fully compatible with SMD and reflow processes and usable as a stand-alone device without the need for cable connection. Besides offering good thermal properties, the LCP body of the antenna provides a higher mechanical strain tolerance than ceramic ones."

• Valuable PCB real estate savings on both sides of the PCB with the use of this miniature antenna
• No removal of ground layers from beneath the antenna is needed
• Consistent antenna RF performance with the application of Laser Direct Structuring (LDS) - a technology known for its excellent precision, performance and repeatability
• The high-temperature base material and the metal plating technology employed allows the antenna to endure reflow temperatures - an ideal condition for a standard SMT process
• The product is halogen-free and RoHS-compliant