130096-0058
Bond-on heat sink for leadless chip carriers and flat packs
Manufacturer:Molex
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 130096-0058
Secondary Manufacturer Part#: 1300960058
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RoHS 10 Compliant -
Tariff Charges
Technical Attributes
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| Description | Value |
|---|
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 3917320050 |
| Schedule B: | 3917320000 |
Factory Lead Time: