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130096-0058

Bond-on heat sink for leadless chip carriers and flat packs

Manufacturer:Molex
Product Category: Thermal Management, Heat Sinks
Avnet Manufacturer Part #: 130096-0058
Secondary Manufacturer Part#: 1300960058
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

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ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 3917320050
Schedule B: 3917320000
In Stock :  0
Additional inventory
Factory Lead Time: 777 Weeks
Price for: Each
Quantity:
Min:2  Mult:2  
USD $: