MT62F768M32D2DS-023 WT:B
DRAM, Mobile LPDDR5, 24 Gbit, 768M x 32bit, 4.266 GHz, FBGA
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1) architecture
- Background ZQ calibration/command-based ZQ calibration, link protection (link ECC) support
- I/O type: Low-swing single-ended, VSS terminated, VOH-compensated output drive, DVFSQ support
- Dynamic voltage frequency scaling core, single-ended CK, single-ended WCK, and single-ended RDQS
- Operating voltage is 1.05V VDD2H / 0.5V VDDQ
- 768 Meg x 32 configuration, 2 die
- 315-ball TFBGA package
- 3GB (24Gb) total density, 8533Mb/s data rate per pin
- Operating temperature rating range from -25°C = Tc = +85°C
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 4.266 GHz | ||
| Mobile LPDDR5 | ||
| FBGA | ||
| Surface Mount | ||
| 768M x 32bit | ||
| 85 °C | ||
| -25 °C | ||
| 1.05 V V |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8542320036 |
| Schedule B: | 8542320023 |
Factory Lead Time: