MT29F4G08ABADAH4-IT:D

NAND Flash technology provides a cost-effective solution for applications requiring high-density, solid-state storage. The MT29F4G08AAA is a 4Gb NAND Flash memory device. The MT29F8G08BAA is a two-die stack that operates as a single 8Gb device. The MT29F8G08DAA is a two-die stack that operates as two independent 4Gb devices. The MT29F16G08FAA is a four-die stack that operates as two independent 8Gb devices, providing a total storage capacity of 16Gb in a single, space-saving package. Micron NAND Flash devices include standard NAND Flash features as well as new features designed to enhance system-level performance. Micron NAND Flash devices use a highly multiplexed 8-bit bus (I/O[7:0]) to transfer data, addresses, and instructions. The five command pins (CLE, ALE, CE#, RE#, WE#) implement the NAND Flash command bus interface protocol. Additional pins control hardware write protection (WP#) and monitor device status (R/B#). This hardware interface creates a low-pin-count device with a standard pinout that is the same from one density to another, allowing future upgrades to higher densities without board redesign. The MT29F4G, MT29F8G, and MT29F16G devices contain two planes per die. Each plane consists of 2,048 blocks. Each block is subdivided into 64 programmable pages. Each page consists of 2,112 bytes. The pages are further divided into a 2,048-byte data storage region with a separate 64-byte area. The 64-byte area is typically used for error management functions. The contents of each page can be programmed in 220µs (TYP), and an entire block can be erased in 1.5ms (TYP). On-chip control logic automates PROGRAM and ERASE operations to maximize cycle endurance.

• Single-level cell (SLC) technology, asynchronous I/O performance
• Array performance, erase block is 700µs (typical), command set is ONFI NAND flash protocol
• Advanced command set, one-time programmable (OTP) mode
• Interleaved die (LUN) operations, read unique ID, internal data move
• Operation status byte provides software method for detecting, operation completion
• Pass/fail condition, write-protect status, quality and reliability
• Internal data move operations supported within the plane from which data is read
• 4Gb density, 8bit device width, SLC level
• 3.3V (2.7–3.6V) operating voltage, asynchronous interface
• 63-ball VFBGA (9 x 11 x 1.0mm) package, industrial operating temperature range from -40°C to 85°C