EDY4016AABG-JD-F-ES-D
DRAM Chip DDR4 SDRAM 4G-Bit 256Mx16 1.2V 96-Pin F-BGA Tray
The DDR4 SDRAM is a high-speed dynamic random-access memory internally configured as an eight-bank DRAM for the x16 configuration and as a 16-bank DRAM for the x4 and x8 configurations. The DDR4 SDRAM uses an 8n-prefetch architecture to achieve high-speed operation. The 8n-prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single READ or WRITE operation for the DDR4 SDRAM consists of a single 8n-bit wide, four-clock data transfer at the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins.
- VDD = VDDQ = 1.2V } 60mV
- VPP = 2.5V, –125mV/+250mV
- 1.2V pseudoopen-drain I/O
- TC of 0°C to 95°C
- 64ms, 8192-cycle refresh at 0°C to 85°C
- 32ms at 85°C to 95°C
- 8 internal banks: 2 groups of 4 banks each
- 8n-bit prefetch architecture
- Programmable data strobe preambles
- Data strobe preamble training
- Command/Address latency (CAL)
- Multipurpose register READ and WRITE capability
- Write and read leveling
- Self refresh mode
- Low-power auto self refresh (LPASR)
- Temperature controlled refresh (TCR)
- Fine granularity refresh
- Self refresh abort
- Maximum power saving
- Output driver calibration
- Nominal, park, and dynamic on-die termination (ODT)
- Data bus inversion (DBI) for data bus
- Command/Address (CA) parity
- Databus write cyclic redundancy check (CRC)
- Per-DRAM addressability
- Connectivit
Technical Attributes
Find Similar Parts
| Description | Value |
|---|
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8542330001 |
| Schedule B: | 8542330000 |