5962-9958502QXC
FPGA 54K Gates 1184 Cells 90MHz/151MHz 0.45um (CMOS) Technology 3.3V/5V 256-Pin CQFP
- RoHS 10 Compliant
- Tariff Charges
The MX devices are single-chip solutions and provide high performance while shortening the system design and development cycle. MX devices can integrate and consolidate logic implemented in multiple PALs, CPLDs, and FPGAs. Example applications include high-speed controllers and address decoding, peripheral bus interfaces, DSP, and co-processor functions. The MX device architecture is based on Microsemi’s patented antifuse technology implemented in a 0.45µm triple-metal CMOS process. With capacities ranging from 3,000 to 54,000 system gates, the MX devices provide performance up to 250 MHz, are live on power-up and have one-fifth the standby power consumption of comparable FPGAs. MX FPGAs provide up to 202 user I/Os and are available in a wide variety of packages and speed grades. The devices are fully compliant with the PCI Local Bus Specification (version 2.1). They deliver 200 MHz on-chip operation and 6.1 ns clock-to-output performance. The storage elements can efficiently address applications requiring wide datapath manipulation and can perform transformation functions such as those required for telecommunications, networking, and DSP.
- High Capacity
- Single-Chip ASIC Alternative
- 3,000 to 54,000 System Gates
- Up to 2.5 kbits Configurable Dual-Port SRAM
- Fast Wide-Decode Circuitry
- Up to 202 User-Programmable I/O Pins
- High Performance
- 5.6 ns Clock-to-Out
- 250 MHz Performance
- 5 ns Dual-Port SRAM Access
- 100 MHz FIFOs
- 7.5 ns 35-Bit Address Decode
- HiRel Features
- Commercial, Industrial, Automotive, and Military Temperature Plastic Packages
- Commercial, Military Temperature, and MIL-STD-883 Ceramic Packages
- QML Certification
- Ceramic Devices Available to DSCC SMD
- Ease of Integration
- Mixed-Voltage Operation (5.0V or 3.3V for core and I/Os), with PCI-Compliant I/Os
- Up to 100% Resource Utilization and 100% Pin Locking
- Deterministic, User-Controllable Timing
- Unique In-System Diagnostic and Verification Capability with Silicon Explore
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| CQFP | ||
| Surface Mount | ||
| 1184 | ||
| 256 | ||
| 202 | ||
| 125 °C | ||
| -55 °C |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | 3A001.A.2.C |
| HTSN: | 8542310060 |
| Schedule B: | 8542310055 |