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IS61QDB42M36A-300M3L

SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA

Manufacturer:ISSI
Product Category: Memory, SRAMs
Avnet Manufacturer Part #: IS61QDB42M36A-300M3L
Secondary Manufacturer Part#: IS61QDB42M36A-300M3L
  • Legend Information Icon RoHS 10 Compliant
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The 72Mb IS61QDB42M36A and IS61QDB44M18A are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have separate I/Os, eliminating the need for high-speed bus turnaround. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. The following are registered internally on the rising edge of the K clock: Read/write address, Read enable ,Write enable ,Byte writes for burst addresses 1 and 3 ,Data-in for burst addresses 1 and 3. The following are registered on the rising edge of the K# clock: Byte writes for burst addresses 2 and 4, Data-in for burst addresses 2 and 4. Byte writes can change with the corresponding data-in to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered one cycle after the write address. The first data-in burst is clocked one cycle later than the write command signal, and the second burst is timed to the following rising edge of the K# clock. Two full clock cycles are required to complete a write operation. During the burst read operation, the data-outs from the first and third bursts are updated from output registers of the second and third rising edges of the C# clock (starting 1.5 cycles later after read command). The data-outs from the second and fourth bursts are updated with the third and fourth rising edges of the C clock. The K and K# clocks are used to time the data-outs whenever the C and C# clocks are tied high. Two full clock cycles are required to complete a read operation. The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interfaces.

  • 2M x 36
  • On-chip delay-locked loop (DLL) for wide datavalid window
  • Separate read and write ports with concurrentread and write operations
  • Synchronous pipeline read with early write operation
  • Double data rate (DDR) interface for read andwrite input ports
  • Fixed 2-bit burst for read and write operations
  • Clock stop support
  • Two input clocks (K and K) for address and controlregistering at rising edges only
  • Two input clocks (C and C) for data output control
  • Two echo Clocks (CQ and CQ) that are deliveredsimultaneously with data
  • +1.8V core power supply and 1.5, 1.8V Vddq,used with 0.75, 0.9V Vref
  • HSTL input and output levels
  • Registered addresses, write and read controls,byte writes, data in, and data outputs
  • Full data coherency
  • Boundary scan using limited set of JTAG 1149.1functions
  • Byte write capability
  • Fine ball grid array (FBGA) package
    • 15mm x 17mm bod

Technical Attributes

Find Similar Parts

Description Value
19 Bit
Pipelined
300 MHz
DDR
72 Mbit
300 MHz
800 mA
0.45 ns
72 Mbit
Surface Mount
165
36 Bit
36 Bit
1
2 MWords
0 to 70 °C
70 °C
0 °C
165FBGA
0
Commercial
1.89 V
1.71 V
1.8 V
1.8000 V

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: 3A991.B.2.A
HTSN: 8542320041
Schedule B: 8542320040
In Stock :  0
Additional inventory
Factory Lead Time: 182 Weeks
Price for: Each
Quantity:
Min:105  Mult:105  
USD $:
105+
$80.08
210+
$76.96
420+
$73.84
840+
$70.72
1680+
$69.42