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IS43R86400D-5BLI-TR

DRAM Chip DDR SDRAM 512M-Bit 64M x 8 2.6V 60-Pin TFBGA T/R

Manufacturer:ISSI
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: IS43R86400D-5BLI-TR
Secondary Manufacturer Part#: IS43R86400D-5BLI-TR
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The 512-Mbit DDR SDRAM achieves high speed data transfer using pipeline architecture and two data word accesses per clock cycle. The 536,870,912-bit memory array is internally organized as four banks of 128Mb to allow concurrent operations. The pipeline allows Read and Write burst accesses to be virtually continuous, with the option to concatenate or truncate the bursts. The programmable features of burst length, burst sequence and CAS latency enable further advantages. The device is available in 8-bit, 16-bit and 32-bit data word size Input data is registered on the I/O pins on both edges of Data Strobe signal(s), while output data is referenced to both edges of Data Strobe and both edges of CLK. Commands are registered on the positive edges of CLK. An Auto Refresh mode is provided, along with a Self Refresh mode. All I/Os are SSTL_2 compatible.

  • Vdd and Vddq: 2.5V ± 0.2V (-6)
  • Vdd and Vddq: 2.6V ± 0.1V (-5)
  • SSTL_2 compatible I/O
  • Double-data rate architecture; two data transfers per clock cycle
  • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver
  • DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs
  • Differential clock inputs (CK and CK)
  • DLL aligns DQ and DQS transitions with CK transitions
  • Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
  • Four internal banks for concurrent operation
  • Data Mask for write data. DM masks write data at both rising and falling edges of data strobe
  • Burst Length: 2, 4 and 8
  • Burst Type: Sequential and Interleave mode
  • Programmable CAS latency: 2, 2.5 and 3
  • Auto Refresh and Self Refresh Modes
  • Auto Precharge
  • TRAS Lockout Supported (tRAP = tRCD

Technical Attributes

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Description Value
13 Bit
200 MHz
8 Bit
512 Mbit
DDR SDRAM
Tin-Silver-Copper
260 °C
200 MHz
155 mA
0.7 ns
512 Mbit
Surface Mount
MSL 3 - 168 hours
60
4
8 Bit
8 Bit
2.6000 V
-40 to 85 °C
85 °C
-40 °C
64M x 8
60TFBGA
60
Industrial
TFBGA
2.5 V
DDR SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8542320028
Schedule B: 8542320015
In Stock :  0
Additional inventory
Factory Lead Time: 112 Weeks
Price for: Each
Quantity:
Min:2500  Mult:2500  
USD $: