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IS43R16160F-6BLI-TR

DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.5V 60-Pin TFBGA T/R

Manufacturer:ISSI
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: IS43R16160F-6BLI-TR
Secondary Manufacturer Part#: IS43R16160F-6BLI-TR
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

ISSI’s 256-Mbit DDR SDRAM achieves high speed datatransfer using pipeline architecture and two data wordaccesses per clock cycle. The 268,435,456-bit memoryarray is internally organized as four banks of 64Mb toallow concurrent operations. The pipeline allows Readand Write burst accesses to be virtually continuous, withthe option to concatenate or truncate the bursts. Theprogrammable features of burst length, burst sequenceand CAS latency enable further advantages. The deviceis available in 8-bit, 16-bit and 32-bit data word sizeInput data is registered on the I/O pins on both edgesof Data Strobe signal(s), while output data is referencedto both edges of Data Strobe and both edges of CLK.Commands are registered on the positive edges of CLK.

  • VDD and VDDQ: 2.5V ± 0.2V
  • SSTL_2 compatible I/O
  • Double-data rate architecture; two data transfers per clock cycle
  • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver
  • DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs
  • Differential clock inputs (CK and CK)
  • DLL aligns DQ and DQS transitions with CK transitions
  • Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
  • Four internal banks for concurrent operation
  • Data Mask for write data. DM masks write data at both rising and falling edges of data strobe
  • Burst Length: 2, 4 and 8
  • Burst Type: Sequential and Interleave mode
  • Programmable CAS latency: 2, 2.5 and 3
  • Auto Refresh and Self Refresh Modes
  • Auto Precharge
  • TRAS Lockout supported (tRAP = tRCD)

Technical Attributes

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Description Value
13 Bit
166 MHz
16 Bit
256 Mbit
DDR SDRAM
Tin-Silver-Copper
260
167 MHz
130 mA
0.7 ns
16M x 16bit
256 Mbit
Surface Mount
MSL 3 - 168 hours
60
4
16 Bit
16 Bit
3.3 V
-40 to 85 °C
85 °C
-40 °C
16M x 16
60TFBGA
60
8 x 13 x 0.8(Max)
Industrial
TFBGA
DDR SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8542320024
Schedule B: 8542320015
In Stock :  0
Additional inventory
Factory Lead Time: 56 Weeks
Price for: Each
Quantity:
Min:2500  Mult:2500  
USD $:
2500+
$3.8038
5000+
$3.6556
10000+
$3.5074
20000+
$3.3592
40000+
$3.29745