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IS43LR32800G-6BL

DRAM Chip Mobile-DDR SDRAM 256M-Bit 8Mx32 1.8V 90-Pin TF-BGA

Manufacturer:ISSI
Product Category: Memory, DRAMs
Avnet Manufacturer Part #: IS43LR32800G-6BL
Secondary Manufacturer Part#: IS43LR32800G-6BL
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The IS43LR32800G is 268,435,456 bits CMOS Mobile Double Data Rate Synchronous DRAM organized as 4 banks of 2,097,152 words x 32 bits. This product uses a double-data-rate architecture to achieve high-speed operation. The Data Input/ Output signals are transmitted on a 32-bit bus. The double data rate architecture is essentially a 2N prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. This product offers fully synchronous operations referenced to both rising and falling edges of the clock. The data paths are internally pipelined and 2n-bits prefetched to achieve very high bandwidth. All input and output voltage levels are compatible with LVCMOS.

  • JEDEC standard 1.8V power supply.
  • VDD = 1.8V, VDDQ = 1.8V
  • Four internal banks for concurrent operation
  • MRS cycle with address key programs
    • CAS latency 2, 3 (clock)
    • Burst length (2, 4, 8, 16)
    • Burst type (sequential & interleave)
  • Fully differential clock inputs (CK, /CK)
  • All inputs except data & DM are sampled at the rising edge of the system clock
  • Data I/O transaction on both edges of data strobe
  • Bidirectional data strobe per byte of data (DQS)
  • DM for write masking only
  • Edge aligned data & data strobe output
  • Center aligned data & data strobe input
  • 64ms refresh period (4K cycle)
  • Auto & self refresh
  • Concurrent Auto Precharge
  • Maximum clock frequency up to 200MHZ
  • Maximum data rate up to 400Mbps/pin
  • Power Saving support
    • PASR (Partial Array Self Refresh)
    • Auto TCSR (Temperature Compensated Self Refresh)

Technical Attributes

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Description Value
12 Bit
166 MHz
32 Bit
256 Mbit
Mobile-DDR SDRAM
Tin-Silver-Copper
260
166 MHz
130 mA
8|5.5 ns
256 Mbit
Surface Mount
MSL 3 - 168 hours
90
4
32 Bit
32 Bit
0 to 70 °C
70 °C
0 °C
8M x 32
90TF-BGA
90
8 x 13 x 0.8(Max)
Commercial
TFBGA
1.8 V
Mobile-DDR SDRAM

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: EAR99
HTSN: 8542320024
Schedule B: 8542320015
In Stock :  0
Additional inventory
Factory Lead Time: 70 Weeks
Price for: Each
Quantity:
Min:240  Mult:240  
USD $:
240+
$5.39
480+
$5.18
960+
$4.97
1920+
$4.76
3840+
$4.6725