CY7C1460KVE33-200AXC
SRAM Chip Sync Quad 3.3V 36M-Bit 1M x 36 3.2ns 100-Pin TQFP Tray
The CY7C1460KVE33 are 3.3 V, 1M × 36 synchronous pipelined burst SRAMs with No Bus Latency (NoBL) logic, respectively. They are designed to support unlimited true back-to-back read/write operations with no wait states. The CY7C1460KVE33 devices are equipped with the advanced (NoBL) logic required to enable consecutive read/write operations with data being transferred on every clock cycle. 6This feature dramatically improves the throughput of data in systems that require frequent write and read transitions. The CY7C1460KVE33 devices are pin-compatible and functionally equivalent to ZBT devices.All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the clock enable (CEN\) signal, which when deasserted suspends operation and extends the previous clock cycle.Write operations are controlled by the byte write selects (BWa\–BWd\ for CY7C1460KVE33) and a write enable (WE\) input. All writes are conducted with on-chip synchronous self-timed write circuitry.Three synchronous chip enables (CE1\, CE2\, and CE3\) and an asynchronous output enable (OE\) enable easy bank selection and output tristate control. To avoid bus contention, the output drivers are synchronously tristated during the data portion of a write sequence.
- Pin-compatible and functionally equivalent to Zero Bus Turnaround (ZBT™)
- Supports 250-MHz bus operations with zero wait states
- Available speed grades are 250, 200, and 167 MHz
- Internally self-timed output buffer control to eliminate the need to use asynchronous OE\
- Fully-registered (inputs and outputs) for pipelined operation
- Byte write capability
- 3.3-V power supply
- 3.3-V/2.5-V I/O power supply
- Fast clock-to-output time
- 2.5 ns (for 250-MHz device)
- Clock enable (CEN\) pin to suspend operation
- Synchronous self-timed writes
- CY7C1460KVE33 available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA packages
- IEEE 1149.1 JTAG-compatible boundary scan
- Burst capability—linear or interleaved burst order
- “ZZ” sleep mode option
- On-chip Error Correction Code (ECC) to reduce Soft Error Rate (SER)
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 20 Bit | ||
| 200 MHz | ||
| 36 Mbit | ||
| Gold over Nickel Palladium | ||
| 260 | ||
| 200 MHz | ||
| 210 mA | ||
| 3.2 ns | ||
| 36 Mbit | ||
| Surface Mount | ||
| MSL 3 - 168 hours | ||
| 100 | ||
| 36 Bit | ||
| 36 Bit | ||
| 4 | ||
| 1 MWords | ||
| 0 to 70 °C | ||
| 70 °C | ||
| 0 °C | ||
| 100TQFP | ||
| 100 | ||
| 14 x 20 x 1.4 | ||
| No | ||
| Commercial | ||
| TQFP | ||
| 3.63 V | ||
| 3.135 V | ||
| 3.3 V | ||
| 3.3000 V |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | 3A991.B.2.B |
| HTSN: | 8542320041 |
| Schedule B: | 8542320040 |