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CY7C1321KV18-250BZC

SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray

Manufacturer:Infineon
Product Category: Memory, SRAMs
Avnet Manufacturer Part #: CY7C1321KV18-250BZC
Secondary Manufacturer Part#: CY7C1321KV18-250BZC
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

CY7C1321KV18 is 1.8 V Synchronous Pipelined SRAMs equipped with DDR II architecture. The DDR II consists of an SRAM core with advanced synchronous peripheral circuitry and a two-bit burst counter. Addresses for read and write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. For CY7C1319KV18 and CY7C1321KV18, the burst counter takes in the least two significant bits of the external address and bursts four 18-bit words in the case of CY7C1319KV18, and four 36-bit words in the case of CY7C1321KV18, sequentially into or out of the device.

  • 18-Mbit density (1 M × 18, 512 K × 36)
  • 333-MHz clock for high bandwidth
  • Four-word burst for reducing address bus frequency
  • Double data rate (DDR) interfaces (data transferred at 666 MHz) at 333 MHz
  • Two input clocks (K and K) for precise DDR timing
    • SRAM uses rising edges only
  • Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches
  • Echo clocks (CQ and CQ) simplify data capture in high speed systems
  • Synchronous internally self-timed writes
  • DDR II operates with 1.5 cycle read latency when DOFF is asserted HIGH
  • Operates similar to DDR I device with one cycle read latency when DOFF is asserted LOW
  • 1.8 V core power supply with HSTL inputs and outputs
  • Variable drive HSTL output buffers
  • Expanded HSTL output voltage (1.4 V-VDD)
    • Supports both 1.5 V and 1.8 V I/O supply
  • Available in 165-ball FBGA package (13 × 15

Technical Attributes

Find Similar Parts

Description Value
19 Bit
Pipelined
250 MHz
DDR
18 Mbit
Tin-Lead
220
250 MHz
370 mA
0.45 ns
18 Mbit
Surface Mount
MSL 3 - 168 hours
165
36 Bit
36 Bit
1
512 kWords
0 to 70 °C
70 °C
0 °C
165FBGA
165
15 x 13 x 0.79 mm
No
Commercial
DDR II SRAM
FBGA
1.8 V
Synchronous
1.8000 V

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: 3A991.B.2.B
HTSN: 8542320041
Schedule B: 8542320040
In Stock :  0
Additional inventory
Factory Lead Time: 2 Weeks
Price for: Each
Quantity:
Min:40  Mult:1  
USD $:
40+
$18.12132
50+
$17.86752
90+
$17.61372
200+
$17.35992
400+
$17.10612