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CY62167GE30-45BVXIT

SRAM Chip Async Single 3V 16M-Bit 2M/1M x 8/16 45ns 48-Pin VFBGA T/R

Manufacturer:Infineon
Product Category: Memory, SRAMs
Avnet Manufacturer Part #: CY62167GE30-45BVXIT
Secondary Manufacturer Part#: CY62167GE30-45BVXIT
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

CY62167GE are high-performance CMOS, low-power (MoBL) SRAM devices with embedded ECC. Both devices are offered in single and dual chip enable options and in multiple pin configurations. The CY62167GE device includes an ERR pin that signals a single-bit error-detection and correction event during a read cycle. To access devices with a single chip enable input, assert the chip enable (CE\) input LOW. To access dual chip enable devices, assert both chip enable inputs - CE1\ as LOW and CE2 as HIGH. To perform data writes, assert the Write Enable (WE\) input LOW, and provide the data and address on the device data pins (I/O0 through I/O15) and address pins (A0 through A19) respectively. The Byte High Enable (BHE\) and Byte Low Enable (BLE\) inputs control byte writes and write data on the corresponding I/O lines to the memory location specified. BHE\ controls I/O8 through I/O15 and BLE\ controls I/O0 through I/O7. To perform data reads, assert the Output Enable (OE\) input and provide the required address on the address lines. You can access read data on the I/O lines (I/O0 through I/O15). To perform byte accesses, assert the required byte enable signal (BHE\ or BLE\) to read either the upper byte or the lower byte of data from the specified address location. All I/Os (I/O0 through I/O15) are placed in a high-impedance state when the device is deselected (CE\ HIGH for a single chip enable device and CE1\ HIGH / CE2 LOW for a dual chip enable device), or the control signals are de-asserted (OE\, BLE\, BHE\). These devices have a unique Byte Power-down feature where, if both the Byte Enables (BHE\ and BLE\) are disabled, the devices seamlessly switch to the standby mode irrespective of the state of the chip enables, thereby saving power.

  • Ultra-low standby current
    • Typical standby current: 5.5 µA
    • Maximum standby current: 16 µA
  • High speed: 45 ns / 55 ns
  • Embedded error-correcting code (ECC) for single-bit errorcorrection
  • Wide voltage range: 1.65 V to 2.2 V, 2.2 V to 3.6 V, and 4.5 Vto 5.5 V
  • 1.0-V data retention
  • Transistor-transistor logic (TTL) compatible inputs and outputs
  • Error indication (ERR) pin to indicate 1-bit error detection andcorrection
  • 48-pin TSOP I package configurable as 1 M × 16 or 2 M × 8SRAM
  • Available in Pb-free 48-ball VFBGA and 48-pin TSOP Ipackages

Technical Attributes

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Description Value
20 Bit
16 Mbit
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36 mA
45 ns
16 Mbit
Surface Mount
MSL 3 - 168 hours
48
8, 16 Bit
1
2, 1 MWords
-40 to 85 °C
85 °C
-40 °C
48VFBGA
48
6 x 8 x 0.81(Max)
No
Industrial
VFBGA
3 V
3.0000 V

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: 3A991B2A
HTSN: 8542320041
Schedule B: 8542320040
In Stock :  0
Additional inventory
Factory Lead Time: 140 Weeks
Price for: Each
Quantity:
Min:2000  Mult:2000  
USD $:
2000+
$9.61343
4000+
$9.09378
8000+
$8.85447
16000+
$8.69602
32000+
$8.65143