IT1-168S-SV
Conn Board to Board RCP 168 POS 0.5mm Solder ST SMD Tray
- RoHS 10 Compliant
- Tariff Charges
High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-to board spacing with transmission speeds exceeding 1GHz. The connection system has matched impedance of 50 ohm or can be customized. Contacts are on 0.5mm pitch.
- Impedance Matching using a 4-Layer Board
- The innovative transmission module uses PC boards with a strip line design of transmission lines, providing matched impedance of 50ohms, for standard product
- Supports Multiple Connectors per board
- Designed with a tolerance of +/- 0.2mm for both the X and Y-axis. The three-piece structure and the +/- 0.2mm tolerance allows 3or more IT1’s to be mounted on a single board
- Customized Board-to-Board Distance
- Board-to-board distance can be customized, from 16mm to40mm.
- Ground lines or additional traces can be added to support high level, high speed transmission or mixed power/signal applications
- Signal to Ground Ratio
- The standard signal-to-ground ratio is 10: 2, which makes reliable matching of the characteristic impedance of each transmission line. This ratio also can be customized
- Contact Reliability
- Useof double contact poin
Technical Attributes
Find Similar Parts
Description | Value | |
---|---|---|
LCP (Liquid Crystal Polymer) | ||
Straight | ||
Phosphor Bronze | ||
Gold | ||
Receptacle | ||
Beige | ||
260 | ||
100 MOhm | ||
Surface Mount | ||
168 POS | ||
2 | ||
-55 to 85 °C | ||
0.5000 mm | ||
8.8 mm | ||
60.7 x 8.8 x 6 mm | ||
6 mm | ||
60.7 mm | ||
Solder |
ECCN / UNSPSC / COO
Description | Value |
---|---|
Country of Origin: | RECOVERY FEE |
ECCN: | EAR99 |
HTSN: | 8536694040 |
Schedule B: | 8536694040 |