GS864436GE-225IV
SRAM Chip Sync Quad 1.8V/2.5V 72M-Bit 2M x 36 6.5ns/2.5ns 165-Pin FBGA Tray
- RoHS 10 Compliant
- Tariff Charges
- FT pin for user-configurable flow through or pipeline operation
- Single/Dual Cycle Deselect selectable
- IEEE 1149.1 JTAG-compatible Boundary Scan
- ZQ mode pin for user-selectable high/low output drive
- 2.5 V or 3.3 V +10%/–10% core power supply
- 2.5 V or 3.3 V I/O supply
- LBO pin for Linear or Interleaved Burst mode
- Internal input resistors on mode pins allow floating mode pins
- Default to SCD x18/x36 Interleaved Pipeline mode
- Byte Write (BW) and/or Global Write (GW) operation
- Internal self-timed write cycle
- Automatic power-down for portable applications
- JEDEC-standard 165-bump BGA package
- RoHS-compliant 165-bump BGA package available
- Green 15 mm x 17 mm, 165 FPBGA
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 21 Bit | ||
| Flow-Through|Pipelined | ||
| 225 MHz | ||
| SDR | ||
| 72 Mbit | ||
| Tin-Silver-Copper | ||
| 260 | ||
| 295@Flow-Through|380@Pipelined mA | ||
| 2, 2.7 V | ||
| 6.5@Flow-Through|2.5@Pipelined ns | ||
| 72 Mbit | ||
| 1.7, 2.3 V | ||
| Surface Mount | ||
| MSL 3 - 168 hours | ||
| 165 | ||
| 36 Bit | ||
| 36 Bit | ||
| 4 | ||
| 2 MWords | ||
| -40 to 85 °C | ||
| 85 °C | ||
| -40 °C | ||
| 165FBGA | ||
| 165 | ||
| 17 x 15 x 1.04 mm | ||
| No | ||
| Industrial | ||
| Synchronous SRAM | ||
| FBGA | ||
| 2, 2.7 V | ||
| 1.7, 2.3 V | ||
| 1.8, 2.5 V | ||
| Synchronous | ||
| 1.8, 2.5 V |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | 3A991.B.2.B |
| HTSN: | 8542320041 |
| Schedule B: | 8542320040 |