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GS8342TT07BGD-333I

SRAM Chip Sync Single 1.8V 36M-Bit 4M x 8 0.45ns 165-Pin FBGA

Manufacturer:Gsi Technology
Product Category: Memory, SRAMs
Avnet Manufacturer Part #: GS8342TT07BGD-333I
Secondary Manufacturer Part#: GS8342TT07BGD-333I
  • Legend Information Icon RoHS 10 Compliant
  • Legend Information Icon Tariff Charges

The GS8342TT07BD is a built in compliance with the -II+ SRAM pin out standard for Common I/O synchronous SRAMs. They are 37,748,736 (36Mb) SRAMs. The GS8342TT07BD -II+ SRAMs are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems.Clocking and Addressing Schemes: The GS8342TT07BD -II+ SRAMs are synchronous devices. They employ two input register clock inputs, K and K. K and K are independent single-ended clock inputs, not differential inputs to a single differential clock input buffer.Because Common I/O -II+ RAMs always transfer data in two packets, A0 is internally set to 0 for the first read or write transfer, and automatically incremented by 1 for the next transfer. Because the LSB is tied off internally, the address field of a -II+ B2 RAM is always one address pin less than the advertised index depth force return (e.g., the 2M x 18 has a 1M addressable index).

  • 2.0 Clock Latency
  • Simultaneous Read and Write ™ Interface
  • Common I/O bus
  • JEDEC-standard pinout and package
  • Double Data Rate interface
  • Byte Write controls sampled at data-in time
  • Burst of 2 Read and Write
  • Dual-Range On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) inputs
  • 1.8 V +100/–100 mV core power supply
  • 1.5 V or 1.8 V HSTL Interface
  • Pipelined read operation with self-timed Late Write
  • Fully coherent read and write pipelines
  • ZQ pin for programmable output drive strength
  • Data Valid pin (QVLD) Support
  • IEEE 1149.1 JTAG-compliant Boundary Scan
  • 3rd Generation, Green, 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
  • RoHS-compliant 165-bump BGA package available

Technical Attributes

Find Similar Parts

Description Value
21 Bit
Pipelined
333 MHz
DDR
36 Mbit
333 MHz
525 mA
0.45 ns
36 Mbit
Surface Mount
165
8 Bit
8 Bit
1
4 MWords
-40 to 100 °C
100 °C
-40 °C
165FBGA
165
15 x 13 x 0.94 mm
No
Industrial
SigmaDDR SRAM
FBGA
1.8 V
Synchronous
1.8000 V

ECCN / UNSPSC / COO

Description Value
Country of Origin: RECOVERY FEE
ECCN: 3A991.B.2.B
HTSN: 8542320041
Schedule B: 8542320040
In Stock :  0
Additional inventory
Factory Lead Time: 168 Weeks
Price for: Each
Quantity:
Min:144  Mult:144  
USD $:
144+
$49.599
288+
$49.3485
576+
$49.098
864+
$48.8475
1152+
$48.597