GS832118AD-250V
SRAM Chip Sync Dual 1.8V/2.5V 36M-Bit 2M x 18 5.5ns/3ns 165-Pin FBGA
- RoHS 10 Compliant
- Tariff Charges
The GS832118 is a 37,748,736-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support.Controls: Addresses, data I/Os, chip enable (E1), address burst control inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are synchronous and are controlled by a positive-edge-triggered clock input (CK). Output enable (G) and power down control (ZZ) are asynchronous inputs. Burst cycles can be initiated with either ADSP or ADSC inputs. In Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address counter may be configured to count in either linear or interleave order with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance.Flow Through/Pipeline Reads: The function of the Data Output register can be controlled by the user via the FT mode pin (Pin 14). Holding the FT mode pin low places the RAM in Flow Through mode, causing output data to bypass the Data Output Register. Holding FT high places the RAM in Pipeline mode, activating the rising-edge-triggered Data Output Register.SCD Pipelined Reads: The GS832118 is a SCD (Single Cycle Deselect) pipelined synchronous SRAM. DCD (Dual Cycle Deselect) versions are also available. SCD SRAMs pipeline deselect commands one stage less than read commands. SCD RAMs begin turning off their outputs immediately after the deselect command has been captured in the input registers.Byte Write and Global Write: Byte write operation is performed by using Byte Write enable (BW) input combined with one or more individual byte write signals (Bx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the Byte Writ
- FT pin for user-configurable flow through or pipeline operation
- Single Cycle Deselect (SCD) operation
- IEEE 1149.1 JTAG-compatible Boundary Scan
- 2.5 V or 3.3 V +10%/–10% core power supply
- 2.5 V or 3.3 V I/O supply
- LBO pin for Linear or Interleaved Burst mode
- Internal input resistors on mode pins allow floating mode pins
- Byte Write (BW) and/or Global Write (GW) operation
- Internal self-timed write cycle
- Automatic power-down for portable applications
- JEDEC-standard 165-bump BGA package
- RoHS-compliant 165-bump BGA package available
- 2nd Generation, 13 mm x 15 mm, 165 FPBGA
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| 21 Bit | ||
| Flow-Through|Pipelined | ||
| 250 MHz | ||
| SDR | ||
| 36 Mbit | ||
| Tin-Lead | ||
| 230@Flow-Through|280@Pipelined mA | ||
| 2, 2.7 V | ||
| 5.5@Flow-Through|3@Pipelined ns | ||
| 36 Mbit | ||
| 1.7, 2.3 V | ||
| Surface Mount | ||
| 165 | ||
| 18 Bit | ||
| 18 Bit | ||
| 2 | ||
| 2 MWords | ||
| 0 to 85 °C | ||
| 85 °C | ||
| 0 °C | ||
| 165FBGA | ||
| 165 | ||
| 15 x 13 x 0.94 mm | ||
| No | ||
| Commercial | ||
| Synchronous SRAM | ||
| FBGA | ||
| 2, 2.7 V | ||
| 1.7, 2.3 V | ||
| 1.8, 2.5 V | ||
| Synchronous | ||
| 1.8, 2.5 V |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | 3A991.B.2.B |
| HTSN: | 8542320041 |
| Schedule B: | 8542320040 |