HCPL-M700-000E

These small outline, low input current, high gain optocouplers are single channel devices in a five lead miniature footprint. The SO-5 JEDEC registered (MO-155) package outline does not require “through holes” in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. These high gain series opto-couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage results in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve conventional photodarlington operation. The HCPL-M701 is for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over a 0-70°C operating range for only 0.5 mA of LED current. The HCPL-M700 is designed for use mainly in TTL applications. Current Transfer Ratio is 300% minimum over 0-70°C for an LED current of 1.6 mA [1 TTL Unit Load (U.L.)]. A 300% CTR enables operation with 1 U.L. out with a 2.2 k? pull-up resistor.

• Surface mountable
• Very small, low profile JEDEC registered package outline
• Compatible with infrared vapor phase reflow and wave soldering processes
• High current transfer ratio: 2000%
• Low input current capability: 0.5 mA
• TTL compatible output: VOL = 0.1 V
• Guaranteed ac and dc performance over temperature: 0°C to 70°C
• High output current: 60 mA
• Recognized under the component program of U.L. for dielectric withstand proof test voltage of 3750 Vac, 1 minute
• Lead free option “-000E”