EA-190-H175-T710
Heat Sink Passive BGA/FPGA Extruded 45.2°C/W Aluminum/Plastic
Manufacturer:Boyd
Product Category:
Thermal Management, Heat Sinks
Avnet Manufacturer Part #: EA-190-H175-T710
Secondary Manufacturer Part#: 345636
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RoHS 10 Compliant -
Tariff Charges
Technical Attributes
Find Similar Parts
| Description | Value | |
|---|---|---|
| Clip | ||
| BGA|FPGA | ||
| Extruded | ||
| Aluminum|Plastic | ||
| 19 x 19 x 17.5 mm | ||
| EA-190 | ||
| 45.2 °C/W | ||
| Passive |
ECCN / UNSPSC / COO
| Description | Value |
|---|---|
| Country of Origin: | RECOVERY FEE |
| ECCN: | EAR99 |
| HTSN: | 8419505000 |
| Schedule B: | 8419500000 |
Factory Lead Time: